参数资料
型号: F1206A2R00FSTR
厂商: AVX Corporation
文件页数: 2/12页
文件大小: 0K
描述: FUSE 2.00A 32V FAST THIN 1206
标准包装: 3,000
系列: Accu-Guard®
保险丝类型: 板安装(不包括管筒式)
额定电流: 2A
额定电压 - DC: 32V
响应时间: 快速
封装/外壳: 1206(3216 公制)
安装类型: 表面贴装
尺寸/尺寸: 0.122" L x 0.063" W x 0.047" H (3.10mm x 1.60mm x 1.20mm)
额定电压时的断路容量: 50A
熔化 I²t: 0.04
批准: cUL,UL
工作温度: -55°C ~ 125°C
包装: 带卷 (TR)
DC 抗冷流: 0.065 欧姆
Accu-Guard ?
SMD Thin-Film Fuse
ELECTRICAL SPECIFICATIONS
Operating Temperature: -55°C to +125°C
Current carrying capacity at -55°C is 107% of rating;
at +25°C 100% of rating; at +85°C 93% of rating;
at +125°C 90% of rating.
Rated Voltage: 32V
Interrupting Rating: 50A
Insulation Resistance: >20MΩ guaranteed (after fusing at rated voltage)
1206
Current Resistance Voltage Drop Fusing Current
Pre-Arc
Part Number
F1206A0R20FWTR
F1206A0R25FWTR
F1206A0R37FWTR
F1206A0R50FWTR
F1206A0R75FWTR
F1206A1R00FWTR
F1206A1R25FWTR
F1206A1R50FWTR
F1206A1R75FWTR
F1206A2R00FWTR
Rating @ 10% x I rated, 25°C @ 1 x I rated, 25°C (within 5 sec.) 25°C
A Ω (Max.) mV (Max.) A
0.200 0.95 350 0.40
0.250 0.75 280 0.50
0.375 0.40 220 0.75
0.500 0.35 220 1.00
0.750 0.25 220 1.50
1.000 0.18 220 2.00
1.250 0.15 220 2.50
1.500 0.11 220 3.00
1.750 0.10 210 3.50
2.000 0.065 160 4.00
I 2 t @ 50A
A 2 - sec.
0.00002*
0.00004*
0.00006
0.0002
0.003
0.005
0.009
0.02
0.035
0.04
* Current is limited to less than 50A at 32V due to internal fuse resistance.
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Storage
Shear
Rapid Change of
Temperature
Vibration
Load Life
Conditions
Components completely immersed in a
solder bath at 235 ±5°C for 2 secs.
Completely immersed in a solder bath
at 260 ±5°C for 60 secs.
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Components mounted to a substrate.
5 cycles -55°C to +125°C.
Per Mil-Std-202F
Method 201A and
Method 204D Condition D.
25°C, I rated, 20,000 hrs.
Requirement
Terminations to be well tinned
No visible damage
Dissolution of termination
≤ 25% of area
ΔR/R<10%
Good solderability
No visible damage
No visible damage
Δ R/R<10%
No visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%
24
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