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参数资料
| 型号： | FAN21SV06EMPX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/17页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 6A 25MLP |
| 标准包装： | 1 |
| 系列： | TinyBuck™ |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 19 V |
| 输入电压： | 3 V ~ 24 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 200kHz ~ 600kHz |
| 电流 - 输出： | 6A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 25-MLP |
| 包装： | 标准包装 |
| 供应商设备封装： | 25-MLP（5x6） |
| 产品目录页面： | 1214 (CN2011-ZH PDF) |
| 其它名称： | FAN21SV06EMPXDKR |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
VIN, VIN_Reg to
AGND
5V_Reg to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
ESD
Conditions
AGND=PGND
AGND=PGND
Continuous
Transient (t < 20 ns, f < 600 KHz)
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.5
-0.5
-5
-0.3
1.5
2.5
Max.
28
6
35
6.0
24.0
30
6.0
Units
V
V
V
V
V
V
V
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Conditions
Min.
Typ.
Max Units
f SW
Switching Frequency
200
500
600
KHz
V IN,
VIN_Reg
T A
T J
Supply Voltage for Power and Bias
Ambient Temperature
Junction Temperature
VIN to PGND
VIN_Reg to AGND
FAN21SV06MX
FAN21SV06EMX
3.0
6.5
-10
-40
24.0
24.0
+85
+85
+125
V
V
°C
°C
°C
Thermal Information
Symbol
T STG
T L
Parameter
Storage Temperature
Lead Soldering Temperature, 30sec
Min.
-65
Typ.
Max.
+150
+300
Units
°C
°C
P1 (Q2)
4
°C/W
θ JC
Thermal Resistance: Junction-to-Case
P2 (Q1)
P3
7
4
°C/W
°C/W
Thermal Resistance: Junction-to-Mounting Surface
35
Total Power Dissipation in the package, T A =25°C
θ J-PCB
P D
(1)
(1)
(1)
2.8
°C/W
W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 37. Actual results
are dependent upon mounting method and surface related to the design.
? 2006 Fairchild Semiconductor Corporation
FAN21SV06 Rev. 1.0.3
4
www.fairchildsemi.com
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