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参数资料
| 型号： | FAN2504S30X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3V .2A SOT23-5 |
| 产品变化通告： | Mold Compound Change 29/Sept/2008 |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3V |
| 输入电压： | 最高 6.5V |
| 电压 - 压降（标准）： | 0.17V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-74A，SOT-753 |
| 供应商设备封装： | SOT-23-5 |
| 包装： | 带卷 (TR) |
Thermal Protection
The FAN2504 can supply high peak output currents of up
to 1 A for brief periods; however, this output load causes
the device temperature to increase and exceed maxi-
mum ratings due to power dissipation. During output
overload conditions, when the die temperature exceeds
the shutdown limit temperature of 150°C, onboard ther-
mal protection disables the output until the temperature
drops below this limit; at which point, the output is then
re-enabled. During a thermal shutdown situation, the
user may assert the power-down function at the enable
pin, reducing power consumption to the minimum level
I GND · V IN .
Thermal Characteristics
The FAN2504 can supply 150 mA at the specified output
voltage with an operating die (junction) temperature of
up to 125°C. Once the power dissipation and thermal
resistance is known, the maximum junction temperature
of the device can be calculated. While the power dissipa-
tion is calculated from known electrical parameters, the
thermal resistance is a result of the thermal characteris-
tics of the compact SOT23-5 surface-mount package
and the surrounding PC Board copper to which it is
mounted.
The power dissipation is equal to the product of the
input-tooutput voltage differential and the output current
plus the ground current multiplied by the input voltage,
or:
P D = ( V IN – V OUT ) I OUT + V IN I GND
The ground pin current, I GND, can be found in the charts
provided in the Electrical Characteristics section.
The relationship describing the thermal behavior of the
package is:
P D ( max ) = ? ------------------------------- ?
? ?
where T J(max) is the maximum allowable junction temper-
ature of the die, which is 125°C, and T A is the ambient
operating temperature. θ JA is dependent on the sur-
rounding PC board layout and can be empirically
obtained. While the θ JC (junction-to-case) of the SOT23-
5 package is specified at 130°C/W, the θ JA of the mini-
mum PWB footprint will be at least 235°C/W. This can be
improved upon by providing a heat sink of surrounding
copper ground on the PCB. Depending on the size of the
copper area, the resulting θ JA can range from approxi-
mately 180°C/W for one square inch to nearly 130°C/W
for four square inches. The addition of backside copper
with through-holes, stiffeners, and other enhancements
can reduce this value. The heat contributed by the dissi-
pation of other devices located nearby must be included
? 2010 Fairchild Semiconductor Corporation
FAN2504 Rev. 2.1.0
10
in design considerations.
Once the limiting parameters in these two relationships
have been determined, the design can be modified to
ensure that the device remains within specified operating
conditions. If overload conditions are not considered, it is
possible for the device to enter a thermal cycling loop, in
which the circuit enters a shutdown condition, cools, re-
enables, and then again overheats and shuts down
repeatedly due to an unmanaged fault condition.
General PCB Layout Considerations
To achieve the full performance of the device, careful cir-
cuit layout and grounding technique must be observed.
Establishing a small local ground, to which the GND pin
and the output and bypass capacitors are connected, is
recommended. The input capacitor should be grounded
to the main ground plane. The quiet local ground is
routed back to the main ground plane using feed-through
vias. In general, the high-frequency compensation com-
ponents (input, bypass, and output capacitors) should be
located as close to the device as possible. The proximity
of the output capacitor is especially important to achieve
optimal noise compensation from the onboard error
amplifier, especially during high load conditions. A large
copper area in the local ground provides the heat sinking
discussed above when high power dissipation signifi-
cantly increases the temperature of the device. Compo-
nent-side copper provides significantly better thermal
performance for this surface-mount device, compared to
that obtained when using only copper planes on the
underside.
www.fairchildsemi.com
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相关代理商/技术参数 |
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| FAN2504S33 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:VOLT REGULATOR|FIXED|+3.3V|CMOS|TSOP|6PIN|PLASTIC |
| FAN2504S33X | 功能描述:低压差稳压器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| FAN2504S33X_Q | 功能描述:低压差稳压器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| FAN2504SX | 功能描述:低压差稳压器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| FAN2504SX_Q | 功能描述:低压差稳压器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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