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参数资料
| 型号： | FAN3100CMPX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/22页 |
| 文件大小： | 0K |
| 描述： | IC GATE DRVR SGL CMOS 2A 6MLP |
| 特色产品： | FANxx Series of High-Speed, Low-Side Gate Drivers |
| 标准包装： | 1 |
| 配置： | 低端 |
| 输入类型： | 差分 |
| 延迟时间： | 15ns |
| 电流 - 峰： | 3A |
| 配置数： | 1 |
| 输出数： | 1 |
| 电源电压： | 4.5 V ~ 18 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-MLP |
| 供应商设备封装： | 6-MLP（2x2） |
| 包装： | 标准包装 |
| 产品目录页面： | 1214 (CN2011-ZH PDF) |
| 其它名称： | FAN3100CMPXDKR |
Ordering Information
Part Number
FAN3100CMPX
FAN3100CSX
FAN3100TMPX
FAN3100TSX
Input
Threshold
CMOS
CMOS
TTL
TTL
Package
6-Lead 2x2mm MLP
5-Pin SOT23
6-Lead 2x2mm MLP
5-Pin SOT23
Packing Method
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Quantity / Reel
3000
3000
3000
3000
Package Outlines
Figure 3. 2x2mm 6-Lead MLP (Top View)
Thermal Characteristics (1)
Figure 4. SOT23-5 (Top View)
Package
6-Lead 2x2mm Molded Leadless Package (MLP)
SOT23-5
Θ JL(2)
2.7
56
Θ JT(3)
133
99
Θ JA(4)
58
157
Ψ JB(5)
2.8
51
Ψ JT(6)
42
5
Units
°C/W
°C/W
Notes:
1.
2.
3.
4.
5.
6.
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL ( Θ JL ): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
Theta_JT ( Θ JT ): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
Theta_JA ( Θ JA ): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink using a 2SP2 board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
Psi_JB ( Ψ JB ): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
Psi_JT ( Ψ JT ): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
? 2007 Fairchild Semiconductor Corporation
FAN3100 ? Rev. 1.0.4
2
www.fairchildsemi.com
相关PDF资料 |
PDF描述 |
|---|---|
| FAN3111CSX | IC GATE DVR 1CH 1A LOW SOT23-5 |
| FAN3111ESX | IC GATE DVR SGL 1A EXTER SOT23-5 |
| FAN3121CMPX | IC GATE DVR SGL 9A LOSIDE 8-MLP |
| FAN3213TMX | IC GATE DRIVER DUAL 4A 8-SOIC |
| FAN3217TMX | IC GATE DRIVER DUAL 2A 8-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| FAN3100CSX | 功能描述:功率驱动器IC single 2A High Speed Low Side CMOS RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FAN3100T | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:2A Low-Voltage PMOS-NMOS Bridge Driver |
| FAN3100TMPX | 功能描述:功率驱动器IC 2A W/DUAL TTL INPUTS RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FAN3100TSX | 功能描述:功率驱动器IC single 2A High Speed Low Side TTL RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FAN3100TSX | 制造商:Fairchild Semiconductor Corporation 功能描述:IC, MOSFET DRIVER, SOT-23 |
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