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参数资料
| 型号： | FAN3223TMX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 3/27页 |
| 文件大小： | 0K |
| 描述： | IC GATE DVR DUAL 4A TTL 8SOIC |
| 标准包装： | 1 |
| 配置： | 低端 |
| 输入类型： | 反相 |
| 延迟时间： | 17ns |
| 电流 - 峰： | 5A |
| 配置数： | 2 |
| 输出数： | 2 |
| 电源电压： | 4.5 V ~ 18 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 标准包装 |
| 产品目录页面： | 1215 (CN2011-ZH PDF) |
| 其它名称： | FAN3223TMXDKR |
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Package Outlines
Figure 2. 3x3 mm MLP-8 (Top View)
Thermal Characteristics (2)
Figure 3. SOIC-8 (Top View)
Package
8-Lead 3x3 mm Molded Leadless Package (MLP)
8-Pin Small Outline Integrated Circuit (SOIC)
? JL(3)
1.2
38
? JT(4)
64
29
? JA(5)
42
87
? JB(6)
2.8
41
? JT(7)
0.7
2.3
Units
°C/W
°C/W
Notes:
2.
3.
4.
5.
6.
7.
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL ( ? JL ): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
Theta_JT ( ? JT ): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
Theta_JA ( Θ JA ): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
Psi_JB ( ? JB ): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 5. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
Psi_JT ( ? JT ): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 5.
? 2007 Fairchild Semiconductor Corporation
FAN3223 / FAN3224 / FAN3225 ? Rev. 1.1.4
3
www.fairchildsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FAN3223TMX_12 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Dual 4A High-Speed, Low-Side Gate Drivers |
| FAN3223TMX_F085 | 制造商:Fairchild Semiconductor Corporation 功能描述:DUAL 4A HIGH SPEED, LOW SIDE GATE DRIVERS - Tape and Reel 制造商:Fairchild Semiconductor Corporation 功能描述:IC GATE DVR DUAL 4A TTL 8SOIC 制造商:Fairchild Semiconductor Corporation 功能描述:TAPE REEL / Dual 4A High Speed, Low Side Gate Drivers |
| FAN3224 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Dual 4A High-Speed, Low-Side Gate Drivers |
| FAN3224C | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Application Review and Comparative Evaluation of Low-Side Gate Drivers |
| FAN3224CMPX | 功能描述:功率驱动器IC Dual 4A High-Speed Low-Side Gate RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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