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参数资料
| 型号： | FAN3850AUC19X |
| 厂商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA6 |
| 封装： | 1.26 X 0.86 MM, WLCSP-6 |
| 文件页数： | 2/11页 |
| 文件大小： | 973K |
| 代理商： | FAN3850AUC19X |
2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3850A Rev. 3.0.1
10
FAN3850A
—
Microphone
Pre-Am
plifier
with
Digita
lOutput
Physical Dimensions
Figure 11. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
FAN3850A External Product Dimensions
Product ID
D
E
X
Y
All options
1.260mm
0.860mm
0.145mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent version. Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
specifications. http://www.fairchildsemi.com/packaging/
.
BOTTOM VIEW
TOP VIEW
1
2
A
B
C
6X
0.005
C A B
(X) +/-0.018
(Y) +/-0.018
0.120±0.010
F
E
D
B
A
PIN A1
AREA
F
2X
(0.120)
CU PAD
SIDE VIEWS
0.06 C
D
C
SEATING
PLANE
0.03 C
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 273 MICRONS
±23 MICRONS (254-300 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006AHrev3.
E
0.080±0.010
0.570
0.485
0.197±0.013
0.300
0.254
0.570
0.485
RECOMMENDED LAND
PATTERN (NSMD)
(0.220)
SOLDER MASK
A1
0.01 C
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