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参数资料
| 型号： | FAN5346S30X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/14页 |
| 文件大小： | 0K |
| 描述： | IC LED DVR ASYNC SER BOOST 6SSOT |
| 标准包装： | 1 |
| 恒定电流： | 是 |
| 拓扑： | PWM，升压（升压） |
| 输出数： | 1 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 通用 |
| 类型 - 次要： | 白色 LED |
| 频率： | 950kHz ~ 1.35MHz |
| 电源电压： | 2.5 V ~ 5.5 V |
| 输出电压： | 6.2 V ~ 28.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 供应商设备封装： | 6-SSOT |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | FAN5346S30XDKR |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
V IN
V FB , V EN
VIN Pin
FB, EN Pins
Parameter
Min.
-0.3
-0.3
Max.
6.0
V IN + 0.3
Unit
V
V
V SW
V OUT
SW Pin
VOUT Pin
FAN5346S20X
FAN5346S30X
FAN5346S20X
FAN5346S30X
-0.3
-0.3
-0.3
-0.3
22.0
33.0
22.0
33.0
V
V
V
V
ESD
T J
T STG
Electrostatic Discharge Protection
Junction Temperature
Storage Temperature
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
-40
-65
1.5
1.5
+150
+150
kV
°C
°C
T L
Lead Soldering Temperature, 10 Seconds
+260
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
V IN
V IN Supply Voltage
Parameter
Min.
2.5
Max.
5.5
Unit
V
V OUT
I OUT
T A
T J
V OUT Voltage (1)
V OUT Load Current
Ambient Temperature
Junction Temperature
FAN5346S20X
FAN5346S30X
6.2
6.2
5
-40
-40
18.5
28.5
25
+85
+125
V
mA
°C
°C
Note:
1. Application should guarantee that minimum and maximum duty cycle fall between 20-85% to meet the specified range.
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
T J(max) at a given ambient temperature T A .
Symbol
θ JA
Parameter
Junction-to-Ambient Thermal Resistance, SSOT23-6 Package
Typical
151
Unit
°C/W
? 2011 Fairchild Semiconductor Corporation
FAN5346 ? Rev. 1.0.1
4
www.fairchildsemi.com
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