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参数资料
| 型号： | FAN5362UC33X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 3/14页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 3.3V 0.5A 6UMLP |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 输入电压： | 2.7 V ~ 5.5 V |
| 频率 - 开关： | 3MHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 6-UMLP（2x2） |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
V IN + 0.3
V IN + 0.3
Symbol
V IN
V SW
V CTRL
V FB
Input Voltage
Voltage on SW Pin
EN and MODE Pin Voltage
FB Pin
Parameter
Min.
–0.3
–0.3
–0.3
–0.3
Max.
6.5
4
(3)
(3)
Unit
V
V
V
V
ESD
T J
T STG
Electrostatic Discharge
Protection Level
Junction Temperature
Storage Temperature
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
–40
–65
3.0
1.5
+150
+150
kV
°C
°C
T L
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
3. Lesser of 6.5V or V IN +0.3V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to Absolute Maximum Ratings.
2.7
Symbol
V CC
I OUT
L
C IN
Parameter
Supply Voltage Range
Output Current for 2.1V
Output Current for 2.5V, 2.7V, 2.9V, 3.3V
Inductor
Input Capacitor
Min.
(4)
0
0
Typ.
1
2.2
Max.
5.5
750
500
Unit
V
mA
μH
μF
C OUT
T A
T J
Output Capacitor
Operating Ambient Temperature
Operating Junction Temperature
–40
–40
10
24
+85
+125
μ F
°C
°C
Note:
4. Minimum V IN = V OUT + 200mV or 2.7V, whichever is greater.
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
1s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
T J(max) at a given ambient temperature T A .
Symbol Parameter
Typical
Unit
? JA
Junction-to-Ambient Thermal Resistance
WLSCP
UMLP
150
49
°C/W
? 2009 Fairchild Semiconductor Corporation
FAN5362 ? Rev. 1.0.5
3
www.fairchildsemi.com
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