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参数资料
| 型号： | FAN5362UMP29X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 12/14页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 2.9V .5A 6WLCSP |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 2.9V |
| 输入电压： | 2.7 V ~ 5.5 V |
| 频率 - 开关： | 3MHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFBGA，CSPBGA |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 6-WLCSP |
Physical Dimensions
0.03 C
F
2X
E
A
BALL A1
INDEX AREA
B
D
F
A1
0.40
0.40
(?0.20)
Cu Pad
(?0.30)
TOP VIEW
2X
0.03 C
Solder Mask
Opening
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.05 C
0.625
0.547
E
0.378±0.018
0.208±0.021
C
SEATING PLANE
D
SIDE VIEWS
0.40
?0.260±0.010
6X
0.005
C A B
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.40
1 2
C
B
A
(Y) +/-0.018
F
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
(X) +/-0.018
BOTTOM VIEW
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006ACrev4.
Figure 27. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP), 2x3 Array, 0.4mm Pitch, 250μm Ball
Product-Specific Dimensions
Product
FAN5362UCX
D
1.310 +/-0.030
E
0.960 +/-0.030
X
0.280
Y
0.255
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2009 Fairchild Semiconductor Corporation
FAN5362 ? Rev. 1.0.5
12
www.fairchildsemi.com
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