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参数资料
| 型号： | FAN5626LX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | IC LED DVR 6CH INTERFACE 10-UMLP |
| 标准包装： | 1 |
| 恒定电流： | 是 |
| 拓扑： | 线性（LDO） |
| 输出数： | 6 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-MicroPak? |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | FAN5626LXDKR |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
VIN Pin
Parameter
Min.
-0.3
Max.
6.0
Unit
V
V CC
ESD
T J
T STG
T L
Other Pins (1)
Electrostatic Discharge Protection Level
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
-0.3
–40
–65
3.0
1.5
V IN +
0.3
+150
+150
+260
V
kV
kV
°C
°C
°C
Note:
1. Lesser of 6.0 V or V IN +0.3 V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
V IN
T A
T J
I LED(FS)
Parameter
Power Supply Voltage Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Full-Scale LED Current
Min.
2.7
-40
-40
5
Max.
5.5
+85
+125
30
Unit
V
°C
°C
mA
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with boards in
accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature T J(max) at a given
ambient temperature T A .
Junction-to-Ambient Thermal Resistance, UMLP10 Package
Symbol
? JA
Parameter
Junction-to-Ambient Thermal Resistance, SSOT23-6 Package
(2)
Junction-to-Ambient Thermal Resistance, MicroPak? MLP10 package (3)
Typical
235
287
220
Unit
°C/W
°C/W
°C/W
Notes:
2. Recommended not to exceed 132 mW of maximum power dissipation.
3. Recommended not to exceed 198 mW of maximum power dissipation.
? 2010 Fairchild Semiconductor Corporation
FAN5622 / FAN5624 / FAN5626 ? Rev. 1.0.3
4
www.fairchildsemi.com
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