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参数资料
| 型号： | FBA1J4BTTE471P |
| 厂商： | KOA SPEER ELECTRONICS INC |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 4 FUNCTIONS, 0.1 A, FERRITE CHIP |
| 封装： | EIA STD PACKAGE SIZE 0603 |
| 文件页数： | 2/3页 |
| 文件大小： | 61K |
| 代理商： | FBA1J4BTTE471P |
FBA
ferrite bead array
applications and ratings
Part
Designation
Impedance
@ 100MHz
(
)
DC
Resistance
Maximum
(
)
Allowable
DC Current
Per Element
Maximum (mA)
Operating
Temperature
Range
FBA1J4ATTE300P
30
FBA1J4ATTE600P
60
FBA1J4ATTE121P
120
FBA1J4ATTE221P
220
FBA1J4ATTE301P
300
FBA1J4ATTE601P
600
FBA1J4ATTE102P
1000
FBA1J4BTTE300P
30
FBA1J4BTTE600P
60
FBA1J4BTTE121P
120
FBA1J4BTTE221P
220
FBA1J4BTTE301P
300
FBA1J4BTTE471P
470
FBA1J4BTTE601P
600
0.1
0.25
0.3
0.4
0.5
0.7
0.25
0.3
0.5
0.55
0.50
0.55
0.65
200
400
350
250
100
200
400
350
100
150
100
-55°C to +125°C
Leach Resistance
Appearance: There shall be no visible signs of
physical or mechanical damage (i.e. no cracks).
Terminations: Termination must not be leached
away for more than 5%.
The bead shall be subjected to the following 5 steps
for the period of time shown below. The 5 steps
constitute one (1) rotation. 4 rotations shall be
carried out.
1) Flux: 5 - 10 seconds
2) After Flux: Air dry for 15 seconds
3) Solder Temperature: 230°C ± 5°C
4) Dip Time: 5 ± 0.5 second
5) Cool: Air cool for 60 seconds
environmental applications
Performance Characteristics
Parameter
Operating Temperature
-55°C to +125°C
Storage Temperature
40°C @ 70% humidity
Sealed plastic bags with desiccant shall be used to
reduce the potential of oxidation on the terminations
during storage.
Resistance to Solder Heat
Change in Impedance: Relative to value before
test ±20%
Appearance: There shall be no cracking.
Solder Coverage: More than 75% of the terminal
electrode shall be covered with solder.
Flux: 5 - 10 second dip
After Flux: Air dry for 15 seconds
Preheat: 150°C ± 10°C
Preheat Time: 60 seconds
Solder Temperature: 260°C ± 5°C
Dip Time: 10 ± 1 second
Solderability
Solder Coverage: More than 95% of the termination
shall be covered with solder.
Flux: 5 - 10 second dip
After Flux: Air dry for 15 seconds
Solder Temperature: 245°C ± 5°C
Dip Time: 5 ± 0.5 second
Requirement
Test Method
NEW
269
KOA Speer Electronics, Inc. Bolivar Drive P.O. Box 547 Bradford, PA 16701 USA 814-362-5536 Fax: 814-362-8883 www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/11/06
EMI/EMC
filtering
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FBA1J4BTTE600P | 制造商:KOA 制造商全称:KOA Speer Electronics, Inc. 功能描述:ferrite bead array |
| FBA1J4BTTE601P | 制造商:KOA 制造商全称:KOA Speer Electronics, Inc. 功能描述:ferrite bead array |
| FBA-24-ALE-050 | 制造商:American Technical Ceramics Corp 功能描述: |
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