参数资料
型号: FBMH1608HM331-T
厂商: Taiyo Yuden
文件页数: 15/15页
文件大小: 0K
描述: FERRITE BEAD 330 OHM 0603
产品培训模块: EMC Applications
产品目录绘图: FBM(H,J) Series_0603
标准包装: 10
系列: FBM
频率对应阻抗: 330 欧姆 @ 100MHz
额定电流: 900mA
DC 电阻(DCR): 最大 130 毫欧
滤波器类型: 差模 - 单线
封装/外壳: 0603(1608 公制)
安装类型: 表面贴装
包装: 标准包装
高度(最大): 0.039"(1.00mm)
尺寸/尺寸: 0.063" L x 0.031" W(1.60mm x 0.80mm)
其它名称: 587-1742-6
5. Handling
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Setting PC boards
1. When setting a chip mounted base board, please make sure that there is no residual stress to the chip by distortion in the board or at
screw part.
Precautions
Technical
considerations
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Setting PC boards
1. There is a case that a characteristic varies with residual stress.
◆Breakaway PC boards (splitting along perforations)
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
6. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
?Recommended conditions
Precautions
Technical
considerations
Ambient temperature 0~40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, inductors should be used within 6 months from the time of delivery.
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_prec_e-E02R01
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