
12
Tyco Electronics Corp.
Data Sheet
July 1998
18 Vdc to 36 Vdc Input, 5 Vdc Output; 50 W
FC250A1 Power Module: dc-dc Converter;
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Then solve the following equation:
Use Figure
17 to determine air velocity for the 1/4 inch
heat sink.
The minimum airflow necessary for the FC250A1 mod-
ule is 1.5 m/s (300 ft./min.).
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θcs) and
sink-to-ambient (
θsa) as shown in Figure
18.8-1304 (F).e
Figure 18. Resistance from Case-to-Sink and
Sink-to-Ambient
For a managed interface using thermal grease or foils,
a value of
θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
refer to the
FLTR100V10 Filter Module Data Sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. This module is designed for
solder interconnection between its terminal pins and
the customer’s board. For additional layout guidelines,
refer to the
FLTR100V10 Filter Module Data Sheet
(DS99-294EPS).
θca
TC
TA
–
()
PD
------------------------
=
θca
85
55
–
()
10
----------------------
=
θca
3 °C/W
=
PD
TC
TS
TA
θcs
θsa
θsa
TC
TA
–
()
PD
-------------------------
θcs
–
=