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参数资料
| 型号： | FCD4A14CCB |
| 元件分类： | 模拟信号调理 |
| 英文描述： | IMAGE SENSOR |
| 封装： | Chip On Board package |
| 文件页数： | 18/18页 |
| 文件大小： | 426K |
| 代理商： | FCD4A14CCB |
FCD4A14 PRELIMINARY SPECIFICATION
9/18
FCD4A14 BLOCK DIAGRAM
PIN DESCRIPTION
Name
Pad
DIL
COB
Pin Type
Function
1 GND
4
1, 16
1,7,21
Ground
2 VCC
18
4
6
Power
Power supply
3 PCLK
5
18
9
Digital Input
Pixel clock
4 RST
17
5
8
Digital Input
Reset
5 OE
16
6
10
Digital Input
Data Output Enable. Tri-state when high
6 Do0
7
15
13
Digital Output
Odd pixel bit 0 LSB
7 Do1
8
14
15
Digital Output
Odd pixel bit 1
8 Do2
9
13
17
Digital Output
Odd pixel bit 2
9 Do3
10
12
19
Digital Output
Odd pixel bit 3 MSB
10 De0
15
7
12
Digital Output
Even pixel bit 0 LSB
11 De1
14
8
14
Digital Output
Even pixel bit 1
12 De2
13
9
16
Digital Output
Even pixel bit 2
13 De3
12
10
18
Digital Output
Even pixel bit 3 MSB
14 ACKN
6
17
11
Digital Output
Acknowledge signal / EPP protocol
15 FPL
11
20
Ground
Front plane. Must be grounded.
16 TPP
19
3
4
Power
Temp. stabilization power
17 TPE
3
19
5
Digital Input
Temp. stabilization enable
18 AVO
2
20
3
Analog Output
Analog output odd pixels
19 AVE
20
2
Analog Output
Analog output even pixels
20 TO
1
N/A
Analog Input
Test purpose only
21 TE
21
N/A
Analog Input
Test purpose only
N/A: not available
DIE MECHANICAL INFORMATION:
Mask set reference
H97A
Passivation/coating
specific
Die size.
1.7 x 17.34 mm
Revision
A
Pad size
100 x 100
mm
Back side potential
Ground
Die thickness
675 ± 25
mm
Transistor count
18827
Die attach
Epoxy
Metallization
Ti (front side)
Poly (back side)
Bond wire
AlSi/Ti
FPL
(pad 11)
DE3
(12)
DE2
(13)
DE1
(14)
DE0
(15)
OE
(16)
RST
(17)
VCC
(18)
TPP
(19)
AVE
(20)
TE
(pad21)
(10) DO3
(9)
DO2
(8)
DO1
(7)
DO0
(6) ACKN
(5) PCLK
(4)
GND
(3)
TPE
(2)
AVO
(pad 1) TO
2240
8
latches
clock
reset
chip
temperature
sensor
column selection
line sel
odd
even
8 lines of 280 columns of pixels
4 bit
ADC
4 bit
ADC
8
1 dummy column
4
amp
chip temperature
stabilization
PCLK
RST
ACKN
De0-3
Do0-3
output
enable
analog
output
OE
AVE AVO
TPE
TPP
1
8
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