
chipbeads_reli-PRP4
chipbeads_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
RECTANGULAR FERRITE CHIP BEADS (HIGH CURRENT) FB series M type
12. High Temperature Loading Test
Specied Value
Appearance
: No signicant abnormality
Impedance change : Within
30% of the initial value
Test Methods and Remarks
Temperature 85 2
Duration 500 24
0 hrs
Applied current Rated current
Mounting method Soldering onto PC board
Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
13. Resistance to Flexure of Substrate
Specied Value
Appearance : No mechanical damage.
Test Methods and Remarks
Warp
: 2mm
Testing board : Glass epoxy-resin substrate
Thickness
: 0.8mm
14. Adhesion of Electrode
Specied Value
No separation or indication of separation of electrode.
Test Methods and Remarks
Applied force : 5N
Duration
: 10 sec.
Note on standard condition: "standard condition" referred to herein is dened as follows:
5 to 35
of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20 2
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless other-
wise specied, all the tests are conducted under the "standard condition."