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参数资料
| 型号： | FCFBMH3225HM102NT |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 2 A, FERRITE CHIP |
| 封装： | ROHS COMPLIANT, EIA STD PACKAGE SIZE 1210, 2 PIN |
| 文件页数： | 9/10页 |
| 文件大小： | 819K |
| 代理商： | FCFBMH3225HM102NT |
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RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
RECTANGULAR FERRITE CHIP BEADS (HIGH CURRENT) FB series M type
1. Operating Temperature Range
Specied Value
40
85
2. Storage Temperature Range
Specied Value
40
85
Test Methods and Remarks
*Note: 0 to
40
in taped packaging
3. Impedance
Specied Value
Within the specied tolerance
Test Methods and Remarks
Measuring equipment : Impedance analyzer (HP4291A) or its equivalent
Measuring frequency : 100 1 MHz
4. DC Resistance
Specied Value
Within the specied range
Test Methods and Remarks
Four-terminal method
Measuring equipment : Milliohm High-Tester 3226 (Hioki Denki) or its equivalent
5. Rated Current
Specied Value
Within the specied range
6. Vibration
Specied Value
Appearance
: No signicant abnormality
Impedance change : Within
30% of the initial value
Test Methods and Remarks
According to JIS C 0040.
Vibration type
: A
Directions
: 2 hrs each in X,Y, and Z directions
Total: 6 hrs
Frequency range : 10 to 55 to 10Hz (/min.)
Amplitude
: 1.5 mm (shall not exceed acceleration 196m/s2)
Mounting method : Soldering onto PC board
7. Solderability
Specied Value
90% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Test Methods and Remarks
Solder temperature : 230 5
Duration
: 4 1 sec.
Preconditioning
: Immersion into ux.
Immersion and Removal speed : 25mm/sec.
8. Resistance to Solder Heat
Specied Value
Appearance
: No signicant abnormality
Impedance change : Within
30% of the initial value
Test Methods and Remarks
Preheating
: 150
for 3 min.
Solder temperature : 260 5
Duration
: 10 0.5 sec.
Preconditioning
: Immersion into ux.
Immersion and Removal speed : 25mm/sec.
Recovery
: 2 to 3 hrs of recovery under the standard condition after the test.
9. Thermal Shock
Specied Value
Appearance
: No signicant abnormality
Impedance change : Within 50
10 % of the initial value
Test Methods and Remarks
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature ( )
Duration (min.)
1
40 3
30 3
2
Room Temperature
Within 3
3
85 2
30 3
4
Room Temperature
Within 3
Number of cycles : 100
Mounting method : Soldering onto PC board
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
10. Humidity (steady state)
Specied Value
Appearances
: No signicant abnormality
Impedance change : Within
30% of the initial value
Test Methods and Remarks
Temperature
: 40 2
Humidity
: 90 to 95% RH
Duration
: 500 24
0 hrs
Mounting method : Soldering onto PC board
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
11. Loading under Damp Heat
Specied Value
Appearances
: No signicant abnormality
Impedance change : Within
30% of the initial value
Test Methods and Remarks
Temperature 40 2
Humidity 90 to 95%RH
Applied current Rated current
Duration 500 24
0 hrs
Mounting method Soldering onto PC board
Recovery 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
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