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参数资料
| 型号： | FCFBMJ4516HS111-T |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 4 A, FERRITE CHIP |
| 封装： | ROHS COMPLIANT, EIA STD PACKAGE SIZE 1806, 2 PIN |
| 文件页数： | 2/10页 |
| 文件大小： | 819K |
| 代理商： | FCFBMJ4516HS111-T |
chipbeads_reli-PRP5
chipbeads_reli_e-01
PRECAUTIONS
FBM Type
This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
Operating environment
1. The products described in this specication are intended for use in general electronic equipment, (ofce supply equipment, telecommunications systems,
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (trafc systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
Rated current
1. Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in case of the
generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating conditions.
2. PCB Design
Precautions
Land pattern design
1. Please refer to a recommended land pattern.
3. Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
consider-
ations
Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
Wave soldering
1. Please refer to the specications in the catalog for a wave soldering.
Reow soldering
1. Please contact any of our ofces for a reow soldering, and refer to the recommended condition specied.
Lead free soldering
1. When using products with lead free soldering, we request to use them after conrming of adhesion, temperature of resistance to soldering heat, etc.
sufciently.
Preheating when soldering
Heating : The temperature difference between soldering and remaining heat should not be greater than 150 .
Cooling : The temperature difference between the components and cleaning process should not be greater than 100 .
Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Technical
consider-
ations
Wave, Reow, Lead free soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of
the products.
Recommended reow condition Pb free solder
180
150
90 30sec.
30 10sec
Duration sec
Solder
joint
temperatur
e
250
200
150
100
50
0
230 min
Peak 260 max
10sec max
Recommended reow condition Pb solder
250
200 180
150
220 5
240 5
Duration sec
5sec max.
150
100
50
0
90 30sec.
30 10sec
Solder
joint
temperatur
e
Preheating when soldering
1. There is a case that products get damaged by a heat shock.
Recommended conditions for using a soldering iron
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of
the products.
5. Handling
Precautions
Handling
1. Keep the inductors away from all magnets and magnetic objects.
Setting PC boards
1. When setting a chip mounted base board, please make sure that there is no residual stress to the chip by distortion in the board or at screw part.
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
Technical
consider-
ations
Handling
1. There is a case that a characteristic varies with magnetic inuence.
Setting PC boards
1. There is a case that a characteristic varies with residual stress.
Breakaway PC boards (splitting along perforations)
1. Planning pattern congurations and the position of products should be carefully performed to minimize stress.
Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
6. Storage conditions
Precautions
Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should
be controlled.
Recommended conditions
Ambient temperature
0 40
Humidity
Below 70% RH
The ambient temperature must be kept below 30 . Even under ideal storage conditions, solderability of products electrodes may decrease as time passes.
For this reason, inductors should be used within 6 months from the time of delivery.
Technical
consider-
ations
Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
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