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参数资料
| 型号： | FDD1206M |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 2 W DC-DC REG PWR SUPPLY MODULE |
| 文件页数： | 3/6页 |
| 文件大小： | 122K |
| 代理商： | FDD1206M |
FD-Family
Switching Regulators, PCB + Chassis
Benign Environment
4 - 86
Edition 2/96 - Melcher AG
MELCHER
The Power Partners.
4.3
Electrical Input and Output Data
General Condition;
TA = 25°C
Table 3a: Input and output data FDD single channel
Characteristics
Conditions
FDD 1106
FDD 1206
FDD 1203
Unit
min
typ
max
min
typ
max
min
typ
max
Output
Uo
Output voltage
Ui min…Ui max
3.2
3.3
3.4
3.2
3.3
3.4
4.85
5.0
5.15
V
Io nom
Output current
Ui min…Ui max
120
360
600
120
360
600
120
360
600
mA
uo
Output ripple
Ui min, Io max
15
mVpp
U
o U
Static line regulation
Ui min...Ui max
±1.5
%
Uo I
Static load regulation
Ui nom, Io min...Io max
±1
Uo/T Thermal coefficient
Ui nom, Io min...Io max
±0.5
Input
Ui
Input voltage
Io min...Io max
5
8
12
6
12
17
6
12
17
V DC
Efficiency
η
Efficiency
Ui nom, Io nom
84
82
87
%
Table 3b: Input and output data FDB single channel
Characteristics
Conditions
FDB 1001
FDB 1002
Unit
min
typ
max
min
typ
max
Output
Uo
Output voltage
Ui min…Ui max
11.64
12
12.36
14.55
15
15.45
V
Io nom
Output current
Ui min…Ui max
45
80
115
40
65
90
mA
uo
Output ripple
Ui min, Io max
58
49
mVpp
Uo U
Static line regulation
Ui min...Ui max
±1.5
%
U
o I
Static load regulation
Ui nom, Io min...Io max
±1
Uo/T Thermal coefficient
Ui nom, Io min...Io max
±0.5
Input
Ui
Input voltage
Io min...Io max
4.5
5
5.5
4.5
5
5.5
V DC
Efficiency
η
Efficiency
Ui nom, Io nom
77
79
%
Parallel Connection
Vi
SD
GND
Vo–
GND
Vo+
FDF 2301M
Master
FDF 2301S
Slave
FDF 2301S
Slave
1
6
1
6
1
6
Drive signal
for parallel
operation
PDR
Fig. 3
Parallel connection
Notes:
– For parallel operation the master parallel drive signal out-
put is connected to the slave parallel drive signal input.
– Up to 5 units can be operated in parallel.
– The converters should be placed close to each other.
Soldering Directions
Best results can be achieved with a soldering temperature
of 215
°C for 10 seconds using a reflow soldering system
after a pre-heating period of 80 seconds at 135
°C. The
switching regulator should not be exposed to the heat for
more than 30 seconds. Solder temperatures exceeding
240
°C may damage the device.
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