参数资料
型号: FDS4675
厂商: FAIRCHILD SEMICONDUCTOR CORP
元件分类: JFETs
英文描述: 40V P-Channel PowerTrench MOSFET
中文描述: 11 A, 40 V, 0.013 ohm, P-CHANNEL, Si, POWER, MOSFET
封装: SO-8
文件页数: 2/5页
文件大小: 73K
代理商: FDS4675
FDS4675 Rev C(W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Test Conditions
Symbol
Parameter
Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage V
GS
= 0 V, I
D
= –250
μ
A
BV
DSS
T
J
Coefficient
I
DSS
Zero Gate Voltage Drain Current
I
GSSF
Gate–Body Leakage, Forward
I
GSSR
Gate–Body Leakage, Reverse
–40
V
Breakdown Voltage Temperature
I
D
= –250
μ
A, Referenced to 25
°
C
–34
mV/
°
C
V
DS
= –32 V, V
GS
= 0 V
V
GS
= 20 V,
V
GS
= –20 V
–1
100
–100
μ
A
nA
nA
V
DS
= 0 V
V
DS
= 0 V
On Characteristics
V
GS(th)
Gate Threshold Voltage
V
GS(th)
T
J
Temperature Coefficient
R
DS(on)
Static Drain–Source
On–Resistance
(Note 2)
V
DS
= V
GS
, I
D
= –250
μ
A
I
D
= –250
μ
A, Referenced to 25
°
C
V
GS
= –10 V,
I
D
= –11 A
V
GS
= –4.5 V, I
D
= –9.5 A
V
GS
=–10 V, I
D
=–11 A, T
J
=125
°
C
V
GS
= –10 V,
V
DS
= –5 V
V
DS
= –5 V,
I
D
= –11 A
–1
–1.4
–3
V
Gate Threshold Voltage
4.6
mV/
°
C
10
13
15
13
17
21
m
I
D(on)
g
FS
On–State Drain Current
Forward Transconductance
–25
A
S
44
Dynamic Characteristics
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
4350
622
290
pF
pF
pF
V
DS
= –20 V,
f = 1.0 MHz
V
GS
= 0 V,
Switching Characteristics
t
d(on)
Turn–On Delay Time
t
r
Turn–On Rise Time
t
d(off)
Turn–Off Delay Time
t
f
Turn–Off Fall Time
Q
g
Total Gate Charge
Q
gs
Gate–Source Charge
Q
gd
Gate–Drain Charge
(Note 2)
20
29
95
60
40
11
13
36
46
152
96
56
ns
ns
ns
ns
nC
nC
nC
V
DD
= –20 V,
V
GS
= –4.5 V,
I
D
= –1 A,
R
GEN
= 6
V
DS
= –20 V,
V
GS
= –4.5 V
I
D
= –11 A,
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
–2.1
A
V
SD
V
GS
= 0 V, I
S
= –2.1 A
(Note 2)
–0.7
–1.2
V
Notes:
1.
R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θ
JC
is guaranteed by design while R
θ
CA
is determined by the user's board design.
a) 50°C/W when
mounted on a 1in
2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in
2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300
μ
s, Duty Cycle < 2.0%
F
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