参数资料
型号: FI-X20S-HF-NPB
厂商: JAE Electronics
文件页数: 6/8页
文件大小: 0K
描述: CONN RCPT 1MM 20POS SMD R/A
标准包装: 43
系列: FI-X
连接器类型: 插座
触点类型:: 母形插口
位置数: 20
加载位置的数目: 全部
间距: 0.039"(1.00mm)
行数: 1
安装类型: 表面贴装,直角
端子: 焊接
特点: 固定焊尾
触点表面涂层:
触点涂层厚度: 3.9µin(0.10µm)
颜色: 浅褐
包装: 托盘
其它名称: 670-1211
FI-X SERIES CONNECTORS
1.00mm (.039") Contact Spacing, Connector for PCB-to-Cable
? ? ? ? ? ? ? ? ? ? ? ? ? ?
THE FI-X SERIES CONNECTORS ARE DESIGNED FOR THIN LCD INTERFACE
applications, and are compatible with high-speed differential
transmissions. They are ideal for use in compact notebook PCs, and
OTHER APPLICATIONS WHERE SIZE AND WEIGHT ARE CRITICAL CONSIDERATIONS.
GENERAL SPECIFICATIONS
Number of Contacts
Contact Spacing
APPLICABLE FPC
Current Rating
14, 20, 30
14 (specifically designed for
DIFFERENTIAL TRANSMISSION/ 7 PAIRS)
1.0MM (.039")
0.14MM ± 0.03MM(.005” ± .001"))
AC/DC 1 AMP PER CONTACT
FEATURES
? COMPATIBLE WITH HIGH-SPEED DIFFERENTIAL
TRANSMISSION AND HIGH-LEVEL IMPEDANCE MATCHING
(90 TO 100 OHMS)
? GREATLY IMPROVED GROUND CONDITION WHICH IS
directly related to EMI characteristics
Dielectric Withstanding Voltage
Insulation Resistance
Contact Resistance
Operating Temperature
Voltage Rating
MATERIALS AND FINISHES
500 VAC R.M.S. (FOR ONE MINUTE)
100 MEGOHMS MIN.
40 MILLIOHMS MAX.
-40°C TO +80°C
AC/DC 200V
? BOTTOM TYPE STRUCTURE PROVIDES 1.5MM (.059")
CONNECTOR HEIGHT AND 1MM (.039") HEIGHT ABOVE THE
PCB
FI-XB**SL-HF10 (Board Connector)
Ground Plate COPPER ALLOY / TIN PLATING
Insulator GLASS fiLLED 4-6 NYLON (UL94V-0, BEIGE)
? 1MM (.039") CONTACT PITCH WITH IMPEDANCE
matching
Shell
Contact
COPPER ALLOY/TIN PLATING
COPPER ALLOY/GOLD PLATING OVER NICKEL
TERMINAL AREA: TIN'LEAD OVER NICKEL
? FPC PROVIDES STABLE GROUNDING TO THE PCB
FI-X**M (Cable Connector)
Ground Plate COPPER ALLOY / TIN PLATING
? COMPATIBLE WITH A VARIETY OF CABLES SUCH AS THIN
wire coaxial cables and flex circuitry
? FRICTION LOCK HOUSING ENABLES SECURE CONNECTIONS
Connector Profile (Ref.)
1
(.039)
Insulator
Shell
Slider
Contact
GLASS fiLLED 4-6 NYLON (UL94V-0, BEIGE)
COPPER ALLOY/TIN PLATING
Thermal Plasticity plating
COPPER ALLOY/GOLD PLATING OVER NICKEL
MATING FPC AREA: TIN'LEAD OVER NICKEL
FPC
1.3 (.051)
CONTACT STROKE
7.9 (.311)
PCB
(Continued Next Page)
Dimensions and specifications subject to change without notice.
54
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相关代理商/技术参数
参数描述
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FI-X30C2EL-C 制造商:Japan Aviation Electronics (JAE) 功能描述:
FI-X30C2EL-SH02-7000 功能描述:FFC & FPC连接器 30P RoHS:否 制造商:JAE Electronics 产品类型:Plugs 系列:HD 节距:0.5 mm 位置/触点数量:40 安装角: 安装风格:Cable 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:100 V per contact 电流额定值:0.24 A to 1 A
FI-X30C2L 制造商:Japan Aviation Electronics (JAE) 功能描述: