参数资料
型号: FI168T578717-T
厂商: Taiyo Yuden
文件页数: 13/14页
文件大小: 0K
描述: FILTER BALUN MULTILAYER
标准包装: 1
系列: FI
频率: 5.78GHz 中心
带宽: 125MHz
滤波器类型: 带通
纹波: 0.2dB
插入损耗: 1dB
封装/外壳: 0603(1608 公制),6 PC 板
安装类型: 表面贴装
包装: 标准包装
高度(最大): 0.020"(0.50mm)
尺寸/尺寸: 0.063" L x 0.031" W(1.60mm x 0.80mm)
其它名称: 587-3008-6
MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS)
■ PRECAUTIONS
1. PCB Design
◆Land pattern design
Land pattern dimension examples
FI325P Type
FI168T/D Type
Unit:mm
FI212B Type
FI168B/L Type
Unit:mm
FI212B245025
FI212B190223
FI168P Type
Unit:mm
FI212L Type
FI212C Type
Unit:mm
Technical
considerations
FI212P Type
Unit:mm
Unit:mm
FI212 P3960A4
Unit:mm
Unit:mm
FI105B/L Type
Unit:mm
Unit:mm
Unit:mm
2. Soldering
◆Conditions for Reflow soldering (for reference)
【Reflow Profile】
300
Preheating
60sec. 60sec
230℃
Within 10sec.
300
Peak
260℃ Max.
Within 10sec.
Technical
considerations
200
100
Min.
Min.
Slow cooling
200
100
Slow
cooling
※ Components should be preheated to within 100
to 130℃ from soldering temperature.
※ Assured to be reflow soldering for 2 times.
0
0
Preheating150℃ Heating above
60sec. Min. 230℃
40sec. Max.
Note : The above profiles are the maximum
allowable soldering condition, therefore
these profiles are not always
recommended.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_prec_e-E02R01
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