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参数资料
| 型号： | FI212C245051-T |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, FERRITE CHIP |
| 文件页数： | 10/10页 |
| 文件大小： | 785K |
| 代理商： | FI212C245051-T |
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■ RELIABILITY DATA
＊This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Operating Temperature Range
Specied Value
－30～＋85℃
2. Storage Temperature Range
Specied Value
－30～＋85℃
【Test Methods and Remarks】
※Note : ー20 to +35℃ in taped packaging
3. Resistance to Flexure of Substrate
Specied Value
No mechanical damage.
【Test Methods and Remarks】
Warp
: 2mm
Testing board : Glass epoxy-resin substrate
Thickness
: 0.8mm
4. Adhesion of Electrode
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
Applied force : 5N
Duration
: 10 sec.
6. Resistance to Solder Heat
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
Preheating
: 150℃ for 2 min.
Preconditioning
: Immersion into ux.
Solder temperature : 260±5℃
Immersion and Removal speed : 25mm/sec.
Duration
: 5±0.5 sec.
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
8. Humidity (steady state)
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
Temperature : ＋40±2℃
Duration : 96 hrs
Humidity
: 90～95%RH
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
9. High temperature life test
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
Temperature : ＋85±2℃
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Duration
: 96 hrs
10. Low temperature life test
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
Temperature : ー40±2℃
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Duration
: 96 hrs
Note on standard condition:
"standard condition" referred to herein is dened as follows :
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement result :
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specied, all the tests are conducted under the "standard condition".
5. Solderability
Specied Value
75% or more of immersed surface of terminal electrode shall be covered with fresh solder.
【Test Methods and Remarks】
Solder temperature : 230±5℃
Preconditioning
: Immersion into ux.
Duration
: 4±1 sec.
Immersion and Removal speed : 25mm/sec.
7. Thermal Shock
Specied Value
Characteristics : shall satisfy the electrical characteristics.
Appearance
: No signicant abnormality.
【Test Methods and Remarks】
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature (℃)
Duration (min)
1
ー40±3℃
30±3
2
Room Temperature
Within 3
3
85±2℃
30±3
4
Room Temperature
Within 3
Number of cycles : 100
Mounting method : Soldering onto PC board.
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
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