参数资料
型号: FIN1001M5X
厂商: Fairchild Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: IC DRIVER 3.3V LVDS HS SOT-23
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
类型: 驱动器
驱动器/接收器数: 1/0
规程: LVDS
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-23-5
包装: 标准包装
产品目录页面: 1217 (CN2011-ZH PDF)
其它名称: FIN1001M5XDKR
www.fairchildsemi.com
2
FIN1001
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
Note 1: The “Absolute Maximum Ratings”: are those values beyond which
damage to the device may occur. The databook specifications should be
met, without exception, to ensure that the system design is reliable over its
power supply, temperature and output/input loading variables. Fairchild
does not recommend operation of circuits outside databook specification.
DC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Note 2: All typical values are at TA = 25°C and with VCC = 3.3V.
AC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Note 3: All typical values are at TA = 25°C and with VCC = 3.3V.
Note 4: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction
(either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.
Supply Voltage (VCC)
0.5V to +4.6V
DC Input Voltage (DIN)
0.5V to +6V
DC Output Voltage (DOUT)
0.5V to +4.6V
Driver Short Circuit Current (IOSD)
Continuous
Storage Temperature Range (TSTG)
65°C to +150°C
Max Junction Temperature (TJ)150°C
Lead Temperature (TL)
(Soldering, 10 seconds)
260
°C
ESD (Human Body Model)
≥ 7500V
ESD (Machine Model)
≥ 400V
Supply Voltage (VCC)
3.0V to 3.6V
Input Voltage (VIN)
0 to VCC
Operating Temperature (TA)
40°C to +85°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
(Note 2)
VOD
Output Differential Voltage
RL = 100 , See Figure 1
250
350
450
mV
V
OD
VOD Magnitude Change from
25
mV
Differential LOW-to-HIGH
VOS
Offset Voltage
1.125
1.25
1.375
V
OS
Offset Magnitude Change from
25
mV
Differential LOW-to-HIGH
IOFF
Power-Off Output Current
VCC = 0V, VOUT = 0V or 3.6V
±20
A
IOS
Short Circuit Output Current
VOUT = 0V
5.5
8
mA
VOD = 0V
±4
±8
VIH
Input HIGH Voltage
2.0
VCC
V
VIL
Input LOW Voltage
GND
0.8
V
IIN
Input Current
VIN = 0V or VCC
±20
A
II(OFF)
Power-Off Input Current
VCC = 0V, VIN = 0V or 3.6V
±20
A
VIK
Input Clamp Voltage
IIK = 18 mA
1.5
0.8
V
ICC
Power Supply Current
No Load, VIN = 0V or VCC
4.5
8
mA
RL = 100 , VIN = 0V or VCC
6.5
10
CIN
Input Capacitance
VCC = 3.3V
3.2
pF
COUT
Output Capacitance
VCC = 0V
3.3
pF
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
(Note 3)
tPLHD
Differential Propagation Delay
0.50.981.5
ns
LOW-to-HIGH
tPHLD
Differential Propagation Delay
0.50.931.5
ns
HIGH-to-LOW
RL = 100 , CL = 10pF,
tTLHD
Differential Output Rise Time (20% to 80%) See Figure 2 and Figure 3
0.4
0.5
1.0
ns
tTHLD
Differential Output Fall Time (80% to 20%)
0.4
0.5
1.0
ns
tSK(P)
Pulse Skew |tPLH - tPHL|
0.05
0.5
ns
tSK(PP)
Part-to-Part Skew (Note 4)
1.0
ns
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