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参数资料
| 型号： | FL05BT04 |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 3 A, FERRITE BEAD |
| 文件页数： | 13/13页 |
| 文件大小： | 430K |
| 代理商： | FL05BT04 |
349
FERRITE
PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
21.Resisitance to soldering
heat
LA
D
Solder temperature
D260M5CfLA02g
270M5CfLA03YLA04YLA05g
Duration
D5M0.5 sec.
One time
Immersed conditions
DInserted into substrate with
= 1.6mm
Recovery
DAt least 1hr of recovery under the standard
condition after the test, followed by the mea-
surement within 2hrs.
LHL
D
Solder bath method
Solder temperature
D260M5C
Duration
D10M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16, LHLP
]
Manual soldering
Solder temperature
D350M10CfAt the tip of soldering irong
Duration
D5M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16, LHLP
]
Caution
DNo excessive pressing shall be applied to terminald
Recovery
D4 to 24hrs of recovery under the standard con-
dition after the tset.
FB
D
Solder bath method
Condition 1
Solder temperature
D260M5C
Duration
D10M1 sec.
Immersion depth
DUp to 1.5mm from terminal root.
Condition 2
Solder temperature
D350M5C
Duration
D3M1 sec.
Immersion depth
DUp to 1.5mm from terminal root.
Recovery
D3hrs of recovery under the standard condition
after the test.
LAV35
D
Solder temperature
D260M5C
Duration
D5M0.5 sec.
Immersion depth
DUp to 2.0 to 2.5mm from botoom of
kinked part.
Recovery
D4 to 24hrs of recovery under the standard con-
dition after the tset.
FL
D
Solder condition
D260M5C
10M1 sec.
Immersion depth
DUp to 0.5 to 1.0mm from terminal root.
Recovery
D3hrs of recovery under the standard condition
after the test.
LA05 Type
LHL
FBA/FBR
LAV35
LA04 Type
No significant abnormality
in appearance
No signifi-
cant abnor-
mality in ap-
pearance
Inductance
change
D
WithinM5L
Q change
D
WithinM30L
f
LHLP
D
only
L/Lg
FL05
Type
FL06BT
Type
L/L
D
WithinM5L
Q
D30min.
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
change
D
WithinM20L
Refer to
individual
specifica-
tion
L/L
D
Within M5L
Q
D15min.
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
change
WithinM20L
RELIABILITY DATA
6/9
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| FL05RD100AT | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 WND TORROIDS/BD S 10MIN uH RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| FL05RD100AZ | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 WND TORROIDS/BD S 10MIN uH RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| FL05RD1R0E | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 WND TORROIDS/BD S 1.0+1.0/-0.5uH RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| FL05RD1R0ET | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 WND TORROIDS/BD S 1.0+1.0/-0.5uH RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| FL05RD1R0EZ | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 WND TORROIDS/BD S 1.0+1.0/-0.5uH RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
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