参数资料
型号: FL4B5BH005D
厂商: THIN FILM TECHNOLOGY CORP
英文描述: 470 MHz, LOW PASS FILTER
文件页数: 2/13页
文件大小: 1036K
代理商: FL4B5BH005D
1210, 4-Pin BGA:
Packaging Requirements:
All taping done in accordance with EIA 481 Standards
Pieces taped with the non-electrode side up and showing through cover tape
Labeling Requirements:
Labels will contain the TFT taped part number and quantity of pieces taped.
Refer to the TFT Taped Part Numbering section for part numbers.
Packaging Materials:
Carrier Tape:
Part # 3MUSO 17931
Cover Tape:
Part # 3M #2673
Reel (7"):
Part # PSSSO#R/PO/8/7
Tape Drawing:
Land Pattern
4025, 14-Pin BGA Land Pattern Specifications:
General Guidelines and Recommendations:
Recommended Pad Material:
Minimum Land Pad Thickness:
Copper Pad Diameter:
Solder Mask Opening:
Solder Volume per Pad:
Recommended Reflow limits:
Max. Temperature
=
Max. Temp. Soak Time =
Misregistration Recovery:
P&P, Placement Max. Force:
Copper
1/2 Ounce Cu (17m)
0.73 ± 0.05mm
0.80 ± 0.05mm
5925 cu. mils (0.097 cu. mm)
260°C
120 sec.
0.32mm
3.0 Lbf
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