参数资料
型号: FP3-2R0
厂商: COOPER INDUSTRIES
元件分类: 通用定值电感
英文描述: 1 ELEMENT, 2 uH, GENERAL PURPOSE INDUCTOR, SMD
封装: SMD
文件页数: 1/3页
文件大小: 102K
代理商: FP3-2R0
Description
155C maximum total temperature operation
Low profile high current inductors
Inductance range 0.1uh to 15uh
Design utilizes high temperature powder iron material
with a non-organic binder to eliminate thermal aging
Current rating up to 34.7Adc (Higher peak currents may
be attained with a greater rolloff, see rolloff curve)
Frequency range up to 2MHz
Applications
Computers and portable power devices
Energy storage applications
DC-DC converters
Input - Output filer application
Environmental Data
Storage temperature range: -40C to +155C
Operating ambient temperature range: -40C to +155C
(range is application specific).
Infrared reflow temperature: +260C for 10 seconds
maximum
Packaging
Units supplied in tape and reel packaging.
Reel quantity = 1,700 parts per reel.
Part
Rated
OCL (1)
Irms (2)
Isat (3)
Isat (4)
DCR
K-factor (5)
Number
Inductance
H ± 15%
Amperes
mOhms @ 20°C
H
Approx. 10%
Approx. 15%
(Max.)
FP3-R10
0.10
19.0
27
34.7
1.21
803
FP3-R20
0.20
0.22
15.3
16
20.8
1.88
482
FP3-R47
0.47
0.44
10.9
11.6
14.9
3.67
344
FP3-R68
0.68
0.72
9.72
9.0
11.6
4.63
268
FP3-1R0
1.00
1.10
6.26
7.4
9.5
11.2
219
FP3-1R5
1.50
5.78
6.2
8.0
13.1
185
FP3-2R0
2.00
5.40
5.4
6.9
15.0
161
FP3-3R3
3.30
3.20
3.63
4.3
5.5
30.0
127
FP3-4R7
4.70
3.23
3.5
4.2
40.0
105
FP3-8R2
8.20
8.5
2.91
2.6
3.4
74.0
78
FP3-150
15.0
14.9
2.22
2.0
2.5
127
59
1) OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2) DC current for an approximate T of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3) Isat Amperes Peak for approximately 10% rolloff @ 20°C
4) Isat Amperes Peak for approximately 15% rolloff @ 20°C
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p =K*L*I
B p-p:(Gauss), K: (K factor from table), L: (Inductance in uH), I (Peak to peak
ripple current in Amps).
FLAT-PAC 3
Low Profile Inductors
Mechanical Diagrams
TOP VIEW
FRONT VIEW
7.50
4.50 (2x)
2.50 (2x)
RECOMMENDED PCB PAD LAYOUT
2
SCHEMATIC
1
3.00 Max
2.8
±0.25
(2x)
XXX
7.25
Max
6.70
Max
yww
2
2.8
±0.25
FP3
(2x)
1
SIDE VIEW
1.0 min.
(2x)
4.0
2.0
12.0
Ao
Ko
Bo
16.0
+/-0.3
7.5
1.75
A
2
1
A
Ao= 6.6mm
Bo= 7.1mm
Ko= 3.2mm
0.3 Rad
max.
1.5 Dia
min.
0.30
+/-0.05
1.5 Dia
+0.1/-0.0
0.5 Rad
typ.
Direction of Feed
SECTION A-A
Packaging Information
Dimensions in Millimeters
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