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参数资料
| 型号： | FPF1014 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH 1V ADVANCE 6WLCSP |
| 标准包装： | 3,000 |
| 系列： | IntelliMax™ |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 27 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 1.5A |
| 输入电压： | 0.8 V ~ 1.8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFBGA，WLCSP |
| 供应商设备封装： | 6-WLCSP |
| 包装： | 带卷 (TR) |
Application Information
Input Capacitor
To limit the voltage drop on the input supply caused by
transient in-rush currents when the switch turns-on, a
capacitor must be placed between VIN and GND. For
minimized voltage drop, especially when the operating
voltage approaches 1 V a 10 μ F ceramic capacitor
should be placed close to the VIN pins. Higher values of
C IN can be used to further reduce the voltage drop
during higher current modes of operation.
Output Capacitor
A 0.1 μ F capacitor, C L , should be placed between
VOUT and GND. This capacitor prevents parasitic board
inductance from forcing V OUT below GND when the
switch turns off. If the application has a capacitive load,
the FPF1014 can be used to discharge that load
through an on-chip output discharge path.
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effects that parasitic trace inductances
may have on normal and short-circuit operation. Using
wide traces or large copper planes for all pins (VIN,
VOUT, ON, and GND) helps minimize the parasitic
electrical effects along with minimizing the case-to-
ambient thermal impedance.
Improving Thermal Performance
Improper layout can result in higher junction
temperature. This applies when continuous operation
current is set to maximum allowed current and switch
turns into a large capacitive load that introduces high
inrush current in the transient. Since FPF1013/14 does
not have thermal shutdown feature, proper layout can
essentially reduce power dissipation of the switch in
transient and prevents the switch exceeding the
maximum absolute power dissipation of 1.2 W.
The VIN, VOUT, and GND pins dissipate most of the
heat generated during a high load current condition. The
layout suggested in Figure 22 provides each pin with
adequate copper so that heat may be transferred as
efficiently as possible out of the device. The ON pin
trace may be laid out diagonally from the device to
maximize the area available to the ground pad. Placing
the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly
during high load currents.
? 2009 Fairchild Semiconductor Corporation
FPF1013 / FPF1014 ? Rev. 1.0.9
9
Figure 22. Proper Layout of Output, Input, and
Ground Copper Area
Demonstration Board Layout
FPF1013/4 demonstration board has the components
and circuitry to demonstrate the load switches functions.
Thermal performance is improved using techniques
recommended in the layout recommendations section of
datasheet.
Figure 23. Demonstration Board Layout
www.fairchildsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FPF1014_11 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:IntelliMAXa?￠ 1V-Rated Advanced Load Management Products |
| FPF1015 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF1016 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF1017 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF1018 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
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