参数资料
型号: FPF1107
厂商: Fairchild Semiconductor
文件页数: 13/14页
文件大小: 0K
描述: IC LOAD MGMT SWITCH P-CH 4-WLCSP
标准包装: 3,000
系列: IntelliMax™
类型: 高端开关
输出数: 1
Rds(开): 55 毫欧
内部开关:
电流限制: 1.2A
输入电压: 1.2 V ~ 4 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 4-UFBGA,WLCSP
供应商设备封装: 4-WLCSP(1x1)
包装: 带卷 (TR)
Physical Dimensions
2X
0.03 C
E
A
B
F
0.50
(?0.250)
Cu Pad
PIN A1 AREA
D
2X
0.03 C
0.50
(?0.350)
Solder Mask
TOP VIEW
0.06 C
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.05 C
0.625
0.539
0.332±0.018
0.250±0.025
C
D
SEATING PLANE
SIDE VIEWS
0.50
0.005
?0.315±0.025
4X
C A B
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B
0.50
1 2
(Y)±0.018
A
F
(X)±0.018
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
BOTTOM VIEW
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC004ABrev2.
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
FPF1107
FPF1108
D
960μm ± 30μm
960um ± 30μm
E
960μm ± 30μm
960um ± 30μm
X
0.230mm
0.230mm
Y
0.230mm
0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 ? Rev. 1.0.1
13
www.fairchildsemi.com
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