参数资料
型号: FPF1203UCX
厂商: Fairchild Semiconductor
文件页数: 11/12页
文件大小: 0K
描述: IC LOAD SWITCH INTELLIMAX 4WLCSP
标准包装: 3,000
系列: IntelliMax™
类型: 高端开关
输出数: 1
Rds(开): 45 毫欧
内部开关:
电流限制: 1.5A
输入电压: 1.2 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 4-UFBGA,WLCSP
供应商设备封装: 4-WLCSP(0.76x0.76)
包装: 带卷 (TR)
Physical Dimensions
2X
0.03 C
E
A
B
F
0.40
?0.20
A1
Cu Pad
BALL A1
INDEX AREA
TOP VIEW
D
2X
0.03 C
0.40
?0.30
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.05 C
C
0.539
0.461
SEATING PLANE
D
E
SIDE VIEWS
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
0.40
?0.260±0.020
4X
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
0.40
B
A
(Y)±0.018
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
1 2
(X)±0.018
F
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
BOTTOM VIEW
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 24. 4-Bump, 0.76 x 0.76 mm, Wafer-Level Chip-Scale Packaging
Product Dimensions
D
760 μm ± 30 μm
E
760 μm ± 30 μm
X
0.180 mm± 0.018 μm
Y
0.180 mm± 0.018 μm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC004AF.pdf .
? 2011 Fairchild Semiconductor Corporation
FPF1203 / FPF1203L / FPF1204 / FPF12045 ? Rev. 1.2.2
11
www.fairchildsemi.com
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