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参数资料
| 型号： | FPF1321UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 1/15页 |
| 文件大小： | 0K |
| 描述： | IC ADVANCED POWER SWITCH 6-WLCSP |
| 标准包装： | 3,000 |
| 系列： | IntelliMax™ |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 60 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 1.5A |
| 输入电压： | 1.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFBGA |
| 供应商设备封装： | 6-WLCSP |
| 包装： | 带卷 (TR) |
September 2013
FPF1320 / FPF1321
IntelliMAX? Dual-Input Single-Output Advanced Power
Switch with True Reverse-Current Blocking
Features
? DISO Load Switches
? Input Supply Operating Range: 1.5 V ~ 5.5 V
? R ON 50 m ? at V IN =3.3 V Per Channel (Typical)
? True Reverse-Current Blocking (TRCB)
? Fixed Slew Rate Controlled 130 μs for < 1 μF C OUT
Description
The FPF1320/21 is a Dual-Input Single-Output (DISO)
load switch consisting of two sets of slew-rate
controlled, low on-resistance, P-channel MOSFET
switches and integrated analog features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the power
rails. The input voltage range operates from 1.5 V to
?
?
?
?
I SW : 1.5 A Per Channel (Maximum)
Quick Discharge Feature on FPF1321
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >6 kV
- Charged Device Model: >1.5 kV
5.5 V to align with the requirements of low-voltage
portable device power rails. FPF1320/21 performs
seamless power-source transitions between two input
power rails using the SEL pin with advanced break-
before-make operation.
FPF1320/21 has a TRCB function to block unwanted
reverse current from output to input during ON/OFF
states. The switch is controlled by logic inputs of the
SEL and EN pins, which are capable of interfacing
-
-
IEC 61000-4-2 Air Discharge: >15 kV
IEC 61000-4-2 Contact Discharge: >8 kV
directly with low-voltage control signals (GPIO).
FPF1321 has 65 ? on-chip load resistor for output quick
discharge when EN is LOW.
Applications
? Smart phones / Tablet PCs
FPF1320/21 is available in 1.0 mm x 1.5 mm WLCSP,
6-bump, with 0.5 mm pitch. FPF1321B is available in
1.0 mm x 1.5 mm WLCSP, 6-bump, 0.5 mm pitch with
?
?
Portable Devices
Near Field Communication (NFC) Capable
SIM Card Power Supply
backside laminate.
Ordering Information
Part Number
Top
Mark
Switch Per
Channel Channel (Typ.)
at 3.3 V IN
Reverse
Current
Blocking
Output Rise
Discharge Time (t R )
Package
FPF1320UCX
QS
DISO
50 m ?
Yes
NA
130 μs
1.0 mm X 1.5 mm
Wafer-Level Chip-
Scale Package
FPF1321UCX
QT
DISO
50 m ?
Yes
65 ?
130 μs
(WLCSP) 6-Bumps,
0.5 mm Pitch
1.0 mm X 1.5 mm
Wafer-Level Chip-
FPF1321BUCX
QT
DISO
50 m ?
Yes
65 ?
130 μs
Scale Package
(WLCSP) 6-Bumps,
0.5 mm Pitch with
Backside Laminate
? 2011 Fairchild Semiconductor Corporation
FPF1320 / FPF1321 ? Rev. 1.0.2
www.fairchildsemi.com
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