参数资料
型号: FPF2194
厂商: Fairchild Semiconductor
文件页数: 13/14页
文件大小: 0K
描述: IC LOAD SWITCH FULL FUNCT 6WLCSP
标准包装: 1
类型: 高端开关
输出数: 1
Rds(开): 80 毫欧
内部开关:
电流限制: 可调
输入电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-UFBGA,WLCSP
供应商设备封装: 6-WLCSP
包装: 标准包装
其它名称: FPF2194DKR
Physical Dimensions
2X
0.03 C
E
A
B
F
(?0.350)
SOLDER MASK
A1
(?0.250)
Cu Pad
OPENING
BALL A1
INDEX AREA
TOP VIEW
D
2X
0.03 C
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.05 C
0.625
0.539
E
0.332±0.018
0.250±0.025
C
SEATING PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
0.50
?0.315 +/- .025
6X
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
1.00
0.50
1 2
C
B
A
(Y) ±0.018
F
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
(X) ±0.018
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 29.
6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
Product
FPF2193
FPF2194
FPF2195
FPF2195BUCX
D
1.480±0.030
1.480±0.030
1.480±0.030
1.480±0.030
E
980±0.030
980±0.030
980±0.030
980±0.030
X
0.240
0.240
0.240
0.240
Y
0.240
0.240
0.240
0.240
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://fsce132/dwg/UC/UC006AF.pdf .
? 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 ? Rev. 1.0.8
13
www.fairchildsemi.com
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