参数资料
| 型号： | FPF2213 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH MICROFET6 |
| 标准包装： | 1 |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 325 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 可调 |
| 输入电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-MLP |
| 供应商设备封装： | 6-MicroFET（2x2） |
| 包装： | 标准包装 |
| 产品目录页面： | 1218 (CN2011-ZH PDF) |
| 其它名称： | FPF2213DKR |
Take note that this is below the maximum package power
The following techniques have been identified to improve the
dissipation, and the thermal shutdown feature will act as
thermal performance of this family of devices.
These
additional safety to protect the part from damage due to
excessive heating. The junction temperature is only able to
increase to the thermal shutdown threshold. Once this
temperature has been reached, toggling ON will not turn-on the
switch until the junction temperature drops. For the FPF2215, a
short on the output will cause the part to operate in a constant
techniques are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
current state dissipating a worst case power of:
2.
Embedding two exposed through-hole vias into the DAP
P (Max) = V IN (MAX) * I LIM (MAX) = 5.5 * 0.276 = 1.5W
This large amount of power will activate the thermal shutdown
and the part will cycle in and out of thermal shutdown so long as
the ON pin is active and the short is present.
PCB Layout Recommendations
In order to benefit from adjustable, high-precision load switch
devices, a high-precision R SET value must be used to set a tight
current limit tolerance. Since I LIMIT (current limit value) is
determined by the voltage drop across the R SET , a poor PCB
layout can introduce parasitic noise on the I SET pin resulting in a
minor variation of I LIMIT . To improve the I LIMIT stability, parasitic
noise coupling mechanisms from I SET to GND must be
minimized. This becomes more critical when I LIMIT is set close
to the nominal load current operation where parasitic effects
could cause the device to go in and out of current limit and
result in an error flag report.
Care must be taken to provide a direct current return path
between the R SET ground pad and the device ground pad
(pin5). Please see current pad #2 in figure below.
1)Power current path
2)RSET current path
Figure 22: Eliminate parasitic noise of ISET-GND by providing a
separate ground route, unique from the power ground plane
Improving Thermal Performance
An improper layout could result in higher junction temperature
and triggering the thermal shutdown protection feature. This
concern applies when the switch is set at higher current limit
value and an over-current condition occurs. In this case, the
power dissipation of the switch, from the formula below, could
exceed the maximum absolute power dissipation of 1.2W.
PD = (V IN - V OUT ) x I LIM (Max)
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
Figure 23: Two through hole open vias embedded in DAP
Figure 24: X-Ray result (bottom view with 45 o angle)
3. The V IN , V OUT and GND pins will dissipate most of the heat
generated during a high load current condition. Using wide
traces will help minimize parasitic electrical effects along with
minimizing the case to ambient thermal impedance. The layout
suggested in Figure 25 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The low-power FLAGB and ON pin traces may be
laid-out diagonally from the device to maximize the area
available to the ground pad. Placing the input and output
capacitors as close to the device as possible also contributes to
heat dissipation, particularly during high load currents.
FPF2213-FPF2215 Rev. C
11
www.fairchildsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FPF2214 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2215 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2223 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2224 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2225 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
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