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参数资料
| 型号： | FPF2702MX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 15/19页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH 0.4-2A OCP 8SOIC |
| 标准包装： | 2,500 |
| 系列： | AccuPower™ |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 114 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 可调 |
| 输入电压： | 2.8 V ~ 36 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
PCB Layout Recommendations
For the best performance, all traces should be as short
as possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effects that parasitic trace inductances
may have on normal and short-circuit operation (Figure
42). Using wide traces for IN, OUT, and GND pins helps
minimize parasitic electrical effects as well as the case-
to-ambient thermal impedance.
To minimize the interference between analog ground
(chip ground, pin 5) and power ground during load
current excursion, the ground terminal of the input and
output capacitors and the R SET resistor should be routed
directly to chip ground and away from power ground.
Improving Thermal Performance
3. The IN, OUT, and GND pins dissipate most of the
heat generated during high-load current condition.
The layout suggested in Figure 42 and Figure 43 is
strongly recommended illustrating a proper layout
for devices in MLP 3x3 packages. IN, OUT, and
GND pins are connected to adequate copper so
that heat may be transferred as efficiently as
possible out of the device. The low-power FLAGB
and ON pins traces may be laid-out diagonally from
the device to maximize the area available to the
ground pad. Place the input and output capacitors
as close as possible to the device.
Improper
layout could result in higher junction
temperature and trigger thermal shutdown protection.
This is particularly significant for the FPF2702, where
the device operates in Constant Current Mode under
overload conditions. During fault conditions, the power
dissipation of the switch could exceed the maximum
absolute power dissipation.
The following techniques improve the thermal
performance of this family of devices. These techniques
are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be
improved by connecting the Die Attach Pad (DAP) of
the MLP 3x3 package to the GND plane of the PCB.
2. Embedding two exposed through-hole vias into the
DAP provides a path for heat to transfer to the back
GND plane of the PCB. A drill size of round, 15 mils
Figure 42. Proper Layout of Output and Ground
Copper Area (Top, SST, and AST Layers)
(0.4 mm) with 1-ounce
copper plating is
recommended for appropriate solder reflow. A
smaller-size
hole prevents the solder from
penetrating into the via, resulting in device lift-up.
Similarly, a larger hole consumes excessive solder
and may result in voiding the DAP.
15 Mil
25 Mil
Figure 41. Two Through-Hole Open Vias
Embedded in the DAP
? 2010 Fairchild Semiconductor Corporation
FPF2700 / FPF2701 / FPF2702 ? Rev. 1.0.3
15
Figure 43. Proper Layout (Bottom and ASB Layers)
www.fairchildsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FPF28 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC |
| FPF29 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC |
| FPF3 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC |
| FPF3003 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:IntelliMAXa?￠ Full Functional Input Power Path Management Switch for Dual-Battery Portable System |
| FPF3003UCX | 功能描述:电源开关 IC - 配电 IntelliMAX Power Path Mgmt Switch RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
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