参数资料
型号: FSA1256L8X_F113
厂商: Fairchild Semiconductor
文件页数: 10/10页
文件大小: 0K
描述: IC SWITCH DUAL SPST 8MICROPAK
产品变化通告: Die Material, Mold Compound Change 03/Oct/2008
标准包装: 1
功能: 开关
电路: 2 x SPST - NO
导通状态电阻: 1.15 欧姆
电压电源: 单电源
电压 - 电源,单路/双路(±): 1.65 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-XFQFN
供应商设备封装: 8-MicroPak?
包装: 标准包装
产品目录页面: 1218 (CN2011-ZH PDF)
其它名称: FSA1256L8XDKR
FSA1256L8XDKR-ND
2004 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA1256(A) / FSA1257(A) / FSA1258(A) Rev. 1.0.9
9
FS
A
125
6(
A
)/
F
S
A
125
7(
A
)/
F
S
A
125
8(
A
)
Low
-R
ON
Low
-V
ol
ta
ge
,D
ua
l
SP
S
T
A
na
log
S
wit
c
h
w
it
h
Low
-I
CCT
Physical Dimensions
(0.09)
(0.1)
(0.2)
1.6
2X
0.05
0.00
1.6
2X
C
0.05 C
4
3. DRAWING CONFORMS TO ASME Y.14M-1994
2. DIMENSIONS ARE IN MILLIMETERS
1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD
BOTTOM VIEW
4. PIN 1 FLAG, END OF PACKAGE OFFSET
MAC08AREV4
1
2
3
5
6
7
8
Notes:
8X
0.25
0.35
3X
8X
1.0
4
0.5
8X
0.25
0.15
0.10
C A B
0.05
C
0.10 C
TOP VIEW
INDEX AREA
B
Recommended Landpattern
A
0.10 C
0.55 MAX
0.05 C
DETAIL A
0.35
0.25
(0.15)
(0.20)
0.35
0.25
DETAIL A
PIN #1 TERMINAL
SCALE: 2X
5. DRAWING FILE NAME: MKT-MAC08AREV4
Figure 17.
8-Lead MicroPak, 1.6 mm Wide
For tape and reel specifications for MicroPak, please visit:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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