参数资料
型号: FSA2467UMX
厂商: Fairchild Semiconductor
文件页数: 1/11页
文件大小: 0K
描述: IC SWITCH DUAL DPDT 16UMLP
标准包装: 5,000
功能: 开关
电路: 2 x DPDT
导通状态电阻: 400 毫欧
电压电源: 单电源
电压 - 电源,单路/双路(±): 1.65 V ~ 4.3 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-UMLP
供应商设备封装: 16-UMLP(1.8x2.6)
包装: 带卷 (TR)
March 2013
2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2467 Rev. 1.0.8
FS
A2
467
0.4
Ω
Low
-Voltage
Dua
l
DP
DT
A
nalog
Swit
ch
FSA2467
0.4
Ω Low-Voltage Dual DPDT Analog Switch
Features
Typical 0.4 On Resistance (R
ON) for +2.7V Supply
Features Less then12A ICCT Current when Sn
Input is Lower than VCC
0.25 Maximum R
ON Flatness for +2.7V Supply
3 x 3mm 16-Lead MLP Package
1.8x2.6mm 16-Lead UMLP Package
Broad V
CC Operating Range
Low THD (0.02% Typical for 32 Load)
Applications
Cell Phone
PDA
Portable Media Player
Description
The FSA2467 is a dual Double-Pole, Double-Throw
(DPDT) analog switch. The FSA2467 operates from a
single 1.65V to 4.3V supply. The FSA2467 features an
ultra-low on resistance of 0.4
at a +2.7V supply and
25°C. This device is fabricated with sub-micron CMOS
technology to achieve fast switching speeds and is
designed for break-before-make operation.
FSA2467 features very low quiescent current even when
the control voltage is lower than the VCC supply. This
feature
allows
mobile
handset
applications
direct
interface with baseband processor general-purpose
I/Os.
Ordering Information
Part Number
Top Mark
Package Description
FSA2467MPX
FSA
2467
16-lead Molded Leadless Package (MLP), JEDEC MO-220, 3 x 3mm Square
FSA2467UMX
GC
16-lead Ultrathin Molded Leadless Package (UMLP), 1.8 x 2.6mm
Application Diagram
Figure 1. Application Diagram
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