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参数资料
| 型号： | FSA8049UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC AUDIO JACK DETECT SW 9-WLCSP |
| 标准包装： | 1 |
| 类型： | 音频插孔探测器和配置开关 |
| 应用： | MP3 播放器，便携式媒体播放器 |
| 安装类型： | * |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | 标准包装 |
| 其它名称： | FSA8049UCXFSDKR |
2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA8049 Rev. 1.0.2
7
FSA8049
—
Audio
Jack
Detect
ion
and
Confi
guration,
MIC/GND
Cr
oss
point
Switch
Physical Dimensions
Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 m Ball
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part
Number
Operating
Temperature
Range
Top
Mark
Package
D
E
X
Y
FSA8049UCX
-40 to +85°C
M3
9-Ball, Wafer-Level Chip-Scale Package
(WLCSP), 3x3 Array, 0.4 mm Pitch,
250 m Ball
1.16 mm 1.16 mm 0.018 mm 0.018 mm
0.03 C
2X
B
A
0.03 C
2X
0.208±0.021
0.378±0.018
D
C
0.06 C
0.05 C
PIN A1
INDEX AREA
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC009ABrev2
F
E
D
A1
0.20
Cu Pad
0.30
Solder Mask
0.40
SIDE VIEWS
0.260±0.020
9X
0.40
(X)±0.018
(Y)±0.018
A
B
C
123
BOTTOM VIEW
TOP VIEW
0.625
0.547
SEATING PLANE
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)
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