参数资料
| 型号： | FSA839UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 10/10页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPDT 6WLCSP |
| 标准包装： | 1 |
| 功能： | 开关 |
| 电路： | 1 x SPDT |
| 导通状态电阻： | 750 毫欧 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.65 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFBGA，WLCSP |
| 供应商设备封装： | 6-WLCSP |
| 包装： | 标准包装 |
| 产品目录页面： | 1218 (CN2011-ZH PDF) |
| 其它名称： | FSA839UCXDKR |
2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA839 Rev. 1.0.0
9
FSA839
—
Low-Voltage,
0.8
Ω
SPDT
Analog
Swit
ch
wit
h
Power-
Of
fIsolat
ion
Physical Dimensions
0.625
0.547
SEATING PLANE
0.06 C
0.05 C
D
C
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. BALL COMPOSITION: Sn95.5-Ag3.9-Cu0.6.
H. DRAWING FILENAME: UC006ACrev2.
BOTTOM VIEW
TOP VIEW
RECOMMENDED LAND PATTERN (NSMD)
E
D
B
A
BALL A1
INDEX AREA
A1
F
SOLDER MASK
OPENING
0.03 C
2X
0.03 C
2X
0.208±0.021
0.378±0.018
1 2
A
B
C
0.40
6X
0.005
CA B
(X) +/-0.018
(Y) +/-0.018
0.260±0.010
F
(0.20)
Cu Pad
(R0.15)
(0.70)
(1.10)
0.40
Figure 12. 6-Ball, WLCSP 0.4mm Pitch
Table 1. Product Specific Dimensions
Product
D
E
X
Y
FSA839UCX
1.160
0.760
0.180
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
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