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参数资料
| 型号： | FSCT17A-UH5 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 运动控制电子 |
| 英文描述： | BRUSHLESS DC MOTOR CONTROLLER, PSIP5 |
| 封装： | IPPAK-5 |
| 文件页数： | 10/11页 |
| 文件大小： | 123K |
| 代理商： | FSCT17A-UH5 |
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FSCTxxA-UH5
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Two components should be used to improve the heat exchange between the FSCT die and the heat sink,
that the temperature has to be monitored. These components are:
s
A thermal interface pad, in order to reduce the impact of air voids on the thermal impedance and to en-
sure an electrical insulation (if needed)
s
A clip to push the IPPAK against the heat sink and then to reduce also the interface thermal imped-
ance.
Several clips can be used depending on the heat sink type:
s
Saddle clips (cf.
figure 9) for slim heat sink;
s
U-clips (cf.
figure 10) for thick heat sink
s
Dedicated clips for special shape heat sink.
Fig. 9: IPPAK mounted with a Saddle clip.
Fig. 10: IPPAK mounted with a U-clip.
It can be noticed that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to those of SOT-32 and
SOT-82 (2.55 +/- 0.15 mm). The same clips can so be used for all these packages.
3.3 Temperature measurement error
Firstly, the time constant between a temperature variation on the external side on the IPPAK copper tab,
and the silicon die is in the range of a few hundred of milliseconds. As temperature phenomena are ex-
tremely slow for the targeted applications (the temperature of a MOSFET heat sink, increases typically with
an 1°C per second rate, in a power supply), the FSCT is able to react immediately to over-heating events.
Moreover, the very low junction to case thermal resistance (3 °C/W) reduces as much as possible the tem-
perature measurement error.
We calculate, in the following, this error considering both the package and the heatsink-Tab interface ther-
mal resistances (
figure 11).
Interface
Fig. 11: IPPAK Heatsink Interface.
Several companies offer adhesive and isolating
materials to be used as interface between elec-
tronic devices and a heat sink. These interfaces
can be provided with a shape dedicated for the
Tab foot print. For the IPPAK package, users could
choose a shape dedicated for SOT-32, SOT-82 or
even TO-126 or TO-220 packages (the more can
do the less).
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相关代理商/技术参数 |
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|---|---|
| FSCTEST | 制造商:Fairchild Semiconductor Corporation 功能描述:. |
| FSCTXXA-UH5 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:FAN SPEED CONTROLER |
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