参数资料
型号: FSGM300N
厂商: Fairchild Semiconductor
文件页数: 4/16页
文件大小: 0K
描述: IC PWM/SENSEFET SMPS 8-DIP
标准包装: 50
系列: FPS™
输出隔离: 隔离
频率范围: 61kHz ~ 73kHz
输入电压: 13 V ~ 22.5 V
输出电压: 650V
功率(瓦特): 40W
工作温度: -40°C ~ 125°C
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-DIP
包装: 管件
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Single Pulsed Avalanche Energy
Symbol
V STR
V DS
V CC
V FB
I DM
I DS
E AS
Parameter
V STR Pin Voltage
Drain Pin Voltage
V CC Pin Voltage
Feedback Pin Voltage
Drain Current Pulsed
Continuous Switching Drain Current (6)
(7)
T C =25 ° C
T C =100 ° C
Min.
- 0.3
Max.
650
650
26
8.0
4
1.90
1.27
190
Unit
V
V
V
V
A
A
A
mJ
P D
Total Power Dissipation (T C =25 ° C)
(8)
1.5
W
T J
T STG
Maximum Junction Temperature
Operating Junction Temperature
Storage Temperature
(9)
- 40
- 55
150
+125
+150
° C
° C
° C
ESD
Electrostatic
Discharge Capability
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
2
2
kV
Notes:
6. Repetitive peak switching current when the inductive load is assumed: Limited by maximum duty (D MAX =0.83)
and junction temperature (see Figure 4) .
7. L=45mH, starting T J =25 ° C.
8. Infinite cooling condition (refer to the SEMI G30-88) .
9. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
Figure 4. Repetitive Peak Switching Current
Thermal Impedance
T A =25°C unless otherwise specified.
Junction-to-Ambient Thermal Impedance
Symbol
θ JA
Parameter
(10)
Value
80
Unit
°C/W
θ JC
Junction-to-Case Thermal Impedance
(11)
20
°C/W
Junction-to-Top Thermal Impedance
Ψ JT
(12)
35
Notes:
10. Infinite cooling condition (refer to the SEMI G30-88) .
11. Free standing with no heat-sink under natural convection.
12. Measured on the package top surface.
? 2009 Fairchild Semiconductor Corporation
FSGM300N ? Rev. 1.0.3
4
www.fairchildsemi.com
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