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参数资料
| 型号： | FSL106MR |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | IC PWM/SEMSEFET SMPS 0.5A 8-DIP |
| 标准包装： | 50 |
| 系列： | FPS™ |
| 输出隔离： | 隔离 |
| 频率范围： | 90kHz ~ 110kHz |
| 输入电压： | 9 V ~ 26 V |
| 输出电压： | 650V |
| 功率（瓦特）： | 13W |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-DIP |
| 包装： | 管件 |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. T J = 25°C unless otherwise specified.
Symbol
V STR
V DS
V CC
V FB
Parameter
V STR Pin Voltage
Drain Pin Voltage
Supply Voltage
Feedback Voltage Range
Min.
-0.3
-0.3
-0.3
Max.
650.0
650.0
26
12.0
Unit
V
V
V
V
Single Pulsed Avalanche Energy
I D
I DM
E AS
P D
T J
Continuous Drain Current
Drain Current Pulsed (4)
Total Power Dissipation
Operating Junction Temperature
(5)
0.5
2
15
1.5
Internally Limited
A
A
mJ
W
°C
T A
T STG
Operating Ambient Temperature
Storage Temperature
-40
-55
+105
+150
°C
°C
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
ESD
Θ JA
(6)
(6)
Junction-to-Ambient Thermal Resistance (7,8)
3
2
80
KV
°C/W
Θ JC
Junction-to-Case Thermal Resistance
(7,9)
19
°C/W
Junction-to-Top Thermal Resistance
Θ JT
(7,10)
33.7
°C/W
Notes:
4. Repetitive rating: pulse-width limited by maximum junction temperature.
5. L=30mH, starting T J =25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested with the standards JESD 51-2 and JESD 51-10.
8. Θ JA free-standing, with no heat-sink, under natural convection.
9. Θ JC junction-to-lead thermal characteristics under Θ JA test condition. T C is measured on the source #7 pin closed
to plastic interface for Θ JA thermo-couple mounted on soldering.
10. Θ JT junction-to-top of thermal characteristic under Θ JA test condition. T t is measured on top of package. Thermo-
couple is mounted in epoxy glue.
? 2010 Fairchild Semiconductor Corporation
FSL106MR ? Rev. 1.0.3
4
www.fairchildsemi.com
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