参数资料
型号: FSL136MR
厂商: Fairchild Semiconductor
文件页数: 4/13页
文件大小: 0K
描述: IC PWM/SEMSEFET SMPS 3A 8-DIP
标准包装: 50
系列: FPS™
输出隔离: 隔离
频率范围: 61kHz ~ 73kHz
输入电压: 9 V ~ 26 V
输出电压: 650V
功率(瓦特): 26W
工作温度: -40°C ~ 105°C
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-DIP
包装: 管件
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only. T J = 25°C, unless otherwise specified.
Symbol
V STR
V DS
V CC
V FB
I D
Parameter
V STR Pin Voltage
Drain Pin Voltage
Supply Voltage
Feedback Voltage Range
Continuous Drain Current
Min.
-0.3
-0.3
-0.3
Max.
650.0
650.0
26
12.0
3
Unit
V
V
V
V
A
I DM
Drain Current Pulsed
(4)
12
A
Single Pulsed Avalanche Energy
E AS
P D
T J
Total Power Dissipation
Operating Junction Temperature
(5)
230
1.5
Internally Limited
mJ
W
°C
T A
T STG
Operating Ambient Temperature
Storage Temperature
-40
-55
+105
+150
°C
°C
Human Body Model, JESD22-A114
ESD
(6)
Charged Device Model, JESD22-C101
(6)
5.0
1.5
KV
Θ JA
Junction-to-Ambient Thermal Resistance
(7,8)
80
°C/W
Θ JC
Junction-to-Case Thermal Resistance
(7,9)
19
°C/W
Θ JT
Junction-to-Top Thermal Resistance
(7,10)
33.7
°C/W
Notes:
4. Repetitive rating: pulse width limited by maximum junction temperature.
5. L=51mH, starting T J =25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested with the standards JESD 51-2 and JESD 51-10.
8. Θ JA free-standing, with no heat-sink, under natural convection.
9. Θ JC junction-to-lead thermal characteristics under Θ JA test condition. T C is measured on the source #7 pin closed
to plastic interface for Θ JA thermo-couple mounted on soldering.
10. Θ JT junction-to-top of thermal characteristic under Θ JA test condition. T t is measured on top of package. Thermo-
couple is mounted in epoxy glue.
? 2009 Fairchild Semiconductor Corporation
FSL136MR ? Rev. 1.0.7
4
www.fairchildsemi.com
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