参数资料
型号: FSTU32160MTDX
厂商: Fairchild Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: IC MUX/DEMUX 1X2 56TSSOP
标准包装: 1,000
功能: 多路复用器/多路分解器
电路: 16 x 1:2
导通状态电阻: 14 欧姆
电压电源: 单电源
电压 - 电源,单路/双路(±): 4 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 56-TFSOP(0.240",6.10mm 宽)
供应商设备封装: 56-TSSOP
包装: 带卷 (TR)
2000 Fairchild Semiconductor Corporation
DS500244
www.fairchildsemi.com
May 1999
Revised October 2006
FSTU32
160
16
-Bi
tto
32-Bi
tMult
ipl
exer
/Demult
ipl
exer
Bus
Swit
ch
wi
th
2
V
Under
shoot
Prot
ecti
o
n
FSTU32160
16-Bit to 32-Bit Multiplexer/Demultiplexer Bus Switch
with
2V Undershoot Protection
General Description
The Fairchild Switch FSTU32160 is a 16-bit to 32-bit high-
speed CMOS TTL-compatible multiplexer/demultiplexer
bus switch. The low on resistance of the switch allows
inputs to be connected to outputs without adding propaga-
tion delay or generating additional ground bounce noise.
The device can be used in applications where two buses
need to be addressed simultaneously. The FSTU32160 is
designed so that the A Port demultiplexes into B1 or B2 or
both. The A and B Ports have “undershoot hardened” cir-
cuit protection to support an extended range to 2.0V below
ground. Fairchild’s integrated Undershoot Hardened Circuit
(UHC) senses undershoot at the I/O’s, and responds by
preventing voltage differentials from developing and turn-
ing on the switch.
Two select (S1, S2) inputs provide switch enable control.
When S1, S2 are HIGH, the device precharges the B Port
to a selectable bias voltage (Bias V) to minimize live inser-
tion noise.
Features
s Undershoot hardened to
2V (A and B Ports).
s Slower Output Enable times prevent signal disruption
s 4
switch connection between two ports.
s Minimal propagation delay through the switch.
s Low lCC.
s Zero bounce in flow-through mode.
s Control inputs compatible with TTL level.
s See Applications Note AN-5008 for details
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
UHC is a registered trademark of Fairchild Semiconductor Corporation.
Order Number
Package Number
Package Description
FSTU32160MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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