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参数资料
| 型号： | FSUSB11L10X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 5/10页 |
| 文件大小： | 0K |
| 描述： | IC USB SWIT DUAL 1X1 10MICROPAK |
| 产品变化通告： | Die Material, Mold Compound Change 03/Oct/2008 |
| 标准包装： | 1 |
| 功能： | USB 开关 |
| 电路： | 2 x 1:1 |
| 导通状态电阻： | 1.15 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.65 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-MicroPak? |
| 包装： | 标准包装 |
| 产品目录页面： | 1219 (CN2011-ZH PDF) |
| 其它名称： | FSUSB11L10XDKR |
Micrel, Inc.
SY54023AR
June 2008
4
M9999-062608-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ............................... –0.5V to +3.0V
Supply Voltage (VCCO) ............................. –0.5V to +2.7V
VCC - VCCO ...............................................................<1.8V
VCCO - VCC ...............................................................<0.5V
Input Voltage (VIN) ............................–0.5V to VCC + 0.5V
CML Output Voltage (VOUT) ............... 0.6V to VCCO+0.5V
Current (VT)
Source or sink current on VT pin .................±100mA
Input Current
Source or sink current on (IN, /IN) .................±50mA
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC)..........................2.375V to 2.625V
(VCCO)………………….….1.14V to 1.9V
Ambient Temperature (TA) ................... –40°C to +85°C
Package Thermal Resistance
(3)
MLF
Still-air (
θ
JA) ............................................ 75°C/W
Junction-to-board (
ψ
JB) ......................... 33°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage Range
VCC
VCCO
2.375
1.14
1.7
2.5
1.2
1.8
2.625
1.26
1.9
V
ICC
Power Supply Current
Max. VCC
37
50
mA
ICCO
Power Supply Current
No Load. VCCO
32
42
mA
RIN
Input Resistance
(IN-to-VT, /IN-to-VT )
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
VIL
Input HIGH Voltage
(IN, /IN)
Input LOW Voltage
(IN, /IN)
IN, /IN
VIL with VIH = 1.2V
1.2
0.2
VCC
VIH–0.1
V
VIH
VIL
Input HIGH Voltage
(IN, /IN)
Input LOW Voltage
(IN, /IN)
IN, /IN
VIL with VIH = 1.14V, (1.2V-5%)
1.14
0.66
VCC
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
see Figure 3a
0.1
1.0
V
VDIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b
0.2
2.0
V
VT_IN
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψ
JB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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