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参数资料
| 型号： | FSUSB45L10X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 5/10页 |
| 文件大小： | 0K |
| 描述： | IC USB SWITCH DPDT 10MICROPAK |
| 产品变化通告： | Die Material, Mold Compound Change 03/Oct/2008 |
| 标准包装： | 1 |
| 功能： | USB 开关 |
| 电路： | 1 x DPDT |
| 导通状态电阻： | 6.5 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 4.3 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-MicroPak? |
| 包装： | 标准包装 |
| 其它名称： | FSUSB45L10XDKR |
4
Precision Edge
SY58024U
Micrel, Inc.
M9999-082807
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (V
CC) .................................. –0.5V to +4.0V
Input Voltage (V
IN) ......................................... –0.5V to VCC
CML Output Voltage (V
OUT) ......... VCC –1.0V to VCC +0.5V
Current (V
T)
Source or Sink Current on VT pin .................. ±100mA
Input Current (V
T)
Source or Sink Current on IN, /IN ..................... ±50mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature (T
S) ........................... –65°C +150°C
Operating Ratings(2)
Supply Voltage (V
CC) ............................ +2.375V to +3.60V
Ambient Temperature (T
A) ......................... –40°C to +85°C
Package Thermal Resistance(3)
MLF (θJA)
Still-Air ............................................................. 35°C/W
500lfpm ............................................................ 28°C/W
MLF (ψJB)
Junction-to-board resistance ........................... 20°C/W
T
A = –40°C to +85°C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply Voltage
2.5V nominal
2.375
2.5
2.625
V
3.3V nominal
3.0
3.3
3.60
V
I
CC
Power Supply Current
V
CC = max., current through internal
200
250
mA
50 source termination resistor included.
V
IH
Input HIGH Voltage
IN, /IN, Note 5
V
CC –1.6
V
CC
V
IL
Input LOW Voltage
IN, /IN
0
V
IH –0.1
V
IN
Input Voltage Swing
IN, /IN, see Figure 1a.
0.1
1.7
V
DIFF_IN
Differential Input Swing
IN, /IN, see Figure 1b.
0.2
V
R
IN
IN-to-V
T Resistance
40
50
60
IN to V
T
1.28
V
DC ELECTRICAL CHARACTERISTICS(4)
VCC = 2.5V ±5% or 3.3V ±10%; TA= -40°C to 85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
VIH
Input HIGH Voltage
2.0
V
VIL
Input LOW Voltage
0.8
V
IIH
Input HIGH Current
40
A
IIL
Input LOW Current
–300
A
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. θJA uses 4-layer
in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. V
IH (min) not lower than 1.2V.
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(4)
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