参数资料
型号: FX11LB-120P/12-SV
厂商: Hirose Electric Co Ltd
文件页数: 1/16页
文件大小: 0K
描述: CONN HEADER 120POS W/O POSTS SMD
标准包装: 50
系列: FX11
连接器类型: 接头,外罩触点
位置数: 120
间距: 0.020"(0.50mm)
行数: 2
安装类型: 表面贴装
特点: 接地板,固定焊尾
触点表面涂层:
触点涂层厚度: 3.9µin(0.10µm)
包装: 托盘
配接层叠高度: 2mm
板上方高度: 0.075"(1.90mm)
其它名称: *FX11LB-120P/12-SV
H2524
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
FX11 Series
Stacking height : 2mm
■ Features
Stacking height : 2.5mm, 3mm
10 Signal: 1 Ground Arrangement
1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs.
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through
5m
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Housing
Ground Plate
Signal contact
m
0.7
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
Metal fitting
0.5
mm
0.7
5m
m
stability achieved serves to reduce noise.
4. Metal Fittings for Added Solder Weld Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling.The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
Ground plate and metal fitting make contact
Stacking height variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
2mm
2. 5 , 3
mm
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. High contact reliability
Effective mating length is 0.55mm (2mm height),
1mm(2.5mm, 3mm height) for signal contacts.
Note: 2.0mm type and 2.5mm, 3mm type are not mated with each other.
Structure Prevent solder vicking
Solder gap portion
A222
8. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
■ Applications
Notebook computers, PDA, and other miniature electronic equipment.
Contact
surface
Board mounting portion
Land
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FX11LB-120S/12-SV 功能描述:CONN RECEPT 120POS W/O POSTS SMD RoHS:否 类别:连接器,互连式 >> 板对板 - 阵列,边缘类型,包厢 系列:FX11 标准包装:3,000 系列:SlimStack™ 502396 连接器类型:插头,外罩触点 位置数:100 间距:0.016"(0.40mm) 行数:2 安装类型:表面贴装 特点:固定焊尾 触点表面涂层:金 触点涂层厚度:8µin(0.20µm) 包装:带卷 (TR) 配接层叠高度:2.5mm 板上方高度:0.084"(2.13mm) 其它名称:502396-1010
FX11LB-120S/12-SV(71) 功能描述:板对板与夹层连接器 REC 120POS W/O POSTS SMT RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A
FX11LB-120S/12-SV(91) 功能描述:板对板与夹层连接器 120P F RECEP SRT SMT NO GIDE POST GRD PLT RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A
FX11LB-120S/12-SV(92) 功能描述:板对板与夹层连接器 120P F RECEP SRT SMT NO GIDE POST GRD PLT RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A
FX11LB-140P-SV 功能描述:板对板与夹层连接器 HDR 140 POS 0.5mm .5mm Solder RA SMD T RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A