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参数资料
| 型号： | FX6-20S-0.8SV |
| 厂商： | Hirose Electric Co Ltd |
| 文件页数： | 13/13页 |
| 文件大小： | 0K |
| 描述： | CONN RECEPT 20POS .8MM W/BOSS |
| 标准包装： | 33 |
| 系列： | FX6 |
| 连接器类型： | 插座，中央带触点 |
| 位置数： | 20 |
| 间距： | 0.031"（0.80mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨 |
| 触点表面涂层： | 金 |
| 包装： | 管件 |
| 配接层叠高度： | 5mm，6mm，7mm |
| 板上方高度： | 0.157"（4.00mm） |
| 其它名称： | *FX6-20S-0.8SV H2426 |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FX6 RoHS ● at Pitch Stacking orcontact to Hirosesalesrepresentative.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website Series search 0.8mm www.hirose-connectors.com, Height 5 your 9mm Connector
B Precautions
1. Tolerance Clearance on Mating Side
The effective contact length of the product is set to 1.7mm. Please use the products as to set the clearance within 1.0mm
between the header and the receptacle in the mating process.
2. Mounting Temperature Profile (Reference)
HRS test conditions
260
(MAX250?)
Test boardGlass epoxy 110mm∞55mm∞1.6mm thick
240
220
200
180
160
140
150?
200?
220?
Solder method :Reflow
Solder composition :Paste,
96.5%Sn/3%Ag/0.5%Cu
Metal mask : 0.15mm thick
Reflow cycles : 2 cycles
The temperature profile is based on the above
(?)
conditions.
0
90 to 120s
Pre-heating time
(150 to 200?)
MAX 60s
Soldering Time
(220? min.)
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
Time (Second)
specific recommendations.
3. Board to Board Size
The board to board size of the male/female connector shown in the application pattern doesn't include the solder paste
thickness. Thus, after the connector is mounted on the board, consider that the board to board size will be widened in
proportion to the solder paste thickness.
A155
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