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参数资料
| 型号： | FX8-90P-SV |
| 厂商： | Hirose Electric Co Ltd |
| 文件页数： | 6/8页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER 90POS .6MM GOLD SMD |
| 标准包装： | 200 |
| 系列： | FX8 |
| 连接器类型： | 接头，外罩触点 |
| 位置数： | 90 |
| 间距： | 0.023"（0.60mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨 |
| 触点表面涂层： | 金 |
| 包装： | 托盘 |
| 配接层叠高度： | 3mm |
| 板上方高度： | 0.112"（2.85mm） |
| 其它名称： | *FX8-90P-SV H2328 |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
on the Hirose website ●RoHSsearchat Pitch Stacking Height 3mm your Hirosesalesrepresentative.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status FX8, FX8C Series 0.6mm www.hirose-connectors.com, or contact to 16mm Connector
B Connector Precautions for use
1. Tolerance Clearance on Mating Side
The effective contact length of the product is set to 0.7mm. Please use the product so as to set the clearance to less than
0.2mm between the header and the receptacle in the mating process.
2. Fixation between Mounting Boards
The very low profile and compact product, so never fix the connector between boards by mating force only
3. Stacking Height Tolerance for Mating
Stack 3mm
Stack 4mm
3
4
+0.3
_0.2
+0.3
_0.2
mm
mm
Note: Please Note that the above stacking tolerance doesn't include the solder paste thickness.
4. Mounting Temperature Profile (Reference)
260
240
(MAX 250?)
HRS test conditions
Test boardGlass epoxy 161mm∞100mm∞1.6mm thick
220
200
200 ?
220 ?
Solder method :Reflow
Solder composition :Paste,
96.5%Sn/3%Ag/0.5%Cu
(?)
180
160
140
150 ?
Metal mask : 0.15mm thick
Reflow cycles : 2 cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
0
90±120s
Pre-heating time
(150 to 200?)
MAX 60s
Soldering Time
(220? min.)
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
Time (Second)
specific recommendations.
A171
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FX8-90P-SV(21) | 制造商:Hirose 功能描述:CONN HEADER 90POS .6MM GOLD SMD |
| FX8-90P-SV(71) | 功能描述:板对板与夹层连接器 90P STRT SMT HEADER BOARD VERTICAL TYPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| FX8-90P-SV(92) | 功能描述:板对板与夹层连接器 90P M HEADER SMT BOARD VERTICAL TYPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| FX8-90P-SV1 | 制造商:Hirose 功能描述:578-0044-9-00 EACH |
| FX8-90P-SV1(21) | 制造商:Hirose 功能描述:CONN HEADER 90POS .6MM GOLD SMD |
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