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| 型号： | FX8C-100P-SV1(91) |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 100 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 3/25页 |
| 文件大小： | 795K |
| 代理商： | FX8C-100P-SV1(91) |
11
FX8C SeriesqHigh-Speed (3.125Gbps) Stacking Connectors
BConnector Precautions
6. Cautions
This product is made as the thin formed product in order to be miniaturized.
1. Tolerance Clearance on Mating Side
The effective contact length of the product is set to 2.0mm. Please use the product
so as to set to less than 1.2mm the clearance between the header and the receptacle in the mating process.
2. Fixation Between Mounting Boards
If this product is fixed only by mating force, Please consider the fixing method so as not to apply loads such as vibration, shock and so
on.
3. Stacking General Tolerance in Mating
Note: Please Note that the above tolerance of the stacking height doesn't include the solder paste thickness.
4. Handling Two-piece Connection Product
Both joint bar edges of the two-piece connection product are fixed by joints, while the mating process can't be performed in that state.
Before the mating process, please remove the joint bars as if pull it up. (Don't remove the joint bars before mounting on the board. )
Before removing joint bar
After removing joint bar
Stack
Amm
A
mm
+0.3
–0.2
5. Mounting Temperature Profile (Reference)
MAX 60s
90±120s
Soldering Time
(220 min.)
Pre-heating time
(150 to 200)
Time (Second)
()
Temperature
150
200
220
140
180
220
0
160
200
(MAX 250)
240
260
HRS test conditions
Test boardGlass epoxy 161mm∞100mm∞1.6mm thick
Solder method
:Reflow
Solder composition
:Paste,
96.5%Sn/3%Ag/0.5%Cu
Metal mask
: 0.15mm thick
Reflow cycles
: 2 cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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| FXL-DMDM-M5 | INTERCONNECTION DEVICE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| FX8C-100P-SV2 | 制造商:Hirose 功能描述:578-0545-4-00 EACH |
| FX8C-100P-SV2(21) | 制造商:Hirose 功能描述:CONN HEADER 100POS .6MM GOLD SMD 制造商:Hirose 功能描述:578-0545-4-21 EACH |
| FX8C-100P-SV2(23) | 制造商:Hirose 功能描述:578-0545-4-23 REEL |
| FX8C-100P-SV2(71) | 功能描述:板对板与夹层连接器 100P STRT SMT HEADER BRD VER TYP TRAY PKG RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| FX8C-100P-SV2(91) | 功能描述:板对板与夹层连接器 HDR 100POS .6MM GOLD SMT RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
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