参数资料
型号: G1117-35T63U
厂商: Global Mixed-mode Technology Inc.
英文描述: 1A Low-Dropout Linear Regulator
中文描述: 1A低压差线性稳压器
文件页数: 2/6页
文件大小: 272K
代理商: G1117-35T63U
Ver: 1.5
Apr 18, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G1117-XX
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature. . . . . . . . . . . . .150°C
Storage Temperature Range . . . -65°C
≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . .260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-223(1). . . . . . . . . . . . . . . . . . . . . . . . . . .116°C/W
TO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
Thermal Resistance Junction to Case, (θJC)
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . . .21°C/W
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10°C/W
Operating Conditions
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . .3V~6V
Temperature Range . . . . . . . . . . . . -40°C
≤ TA ≤ 85°C
Note (1): See Recommended Minimum Footprint
Electrical Characteristics
Operating Conditions: VIN ≤ 6V, TJ = 25°C unless otherwise specified. [Note3]
PARAMETER
CONDITION
MIN TYP MAX UNIT
Output Voltage
10mA< IOUT < 1A
2%
VO
3%
V
Line Regulation
(VOUT + 1.5V) < VIN < 6V, IOUT = 10mA
---
3
30
mV
Load Regulation
VIN = 5V, 10mA < IOUT < 1A
---
35
50
mV
Dropout Voltage
ΔVOUT = 2%, IOUT = 1A
---
1.3
1.4
V
Short Circuit Current
---
1.6
---
A
Quiescent Current
0.3
0.6
1.5
mA
Ripple Rejection
f = 120Hz, COUT = 10μF Tantalum, Vripple = 2VP-P, IOUT = 100mA
---
50
---
dB
Thermal Resistor Junction-to-Ambient
(No heat sink; No air flow)
SOT-223; Recommended Minimum Footprint
---
116
---
°C/W
Thermal Shutdown
Junction Temperature
---
150
---
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
Note2:
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G1117-XX in SOT-223 package;
θJA is 116°C/W; in the TO-252 package, θJA is 86°C/W (See recommend minimum
footprint). The safe operation in SOT-223, TO-252 package, it can see “Typical Performance Characteristics” (Safe
Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Output Voltage
The G1117-XX provides in four fixed voltages = 1.5V,
1.8V, 2.5V, 3.3V and 3.5V. Its quiescent current is
typically 600μA.
Dropout Voltage
The input/output Voltage differential at which the
regulator output no longer maintains regulation
against further reductions in input voltage. Measured
when the output drops 2% below its nominal value.
Dropout voltage is affected by junction temperature,
load current and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions of
low dissipation or by using pulse techniques such that
average chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load cur-
rent at constant chip temperature. The measurement is
made under conditions of low dissipation or by using
pulse techniques such that average chip temperature is
not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip and
is not delivered to the load.
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