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参数资料
| 型号： | G6WK-1P DC12 |
| 厂商： | Omron Electronics Inc-EMC Div |
| 文件页数： | 7/10页 |
| 文件大小： | 0K |
| 描述： | RELAY RF SPDT 10MA 12V |
| 标准包装： | 50 |
| 系列： | G6W |
| 继电器类型： | RF |
| 线圈类型： | 锁存，双线圈 |
| 线圈电流： | 30mA |
| 线圈电压： | 12VDC |
| 触点形式： | SPDT（1 C 型） |
| 触点额定值（电流）： | 10mA |
| 切换电压： | 30VAC，30VDC - 最小值 |
| 关闭电压（最大）： | 9.6 VDC |
| 特点： | 密封式 - 全部 |
| 安装类型： | 通孔 |
| 端接类型： | PC 引脚 |
| 包装： | 散装 |
| 触点材料： | 铜（Cu），金（Au） |
| 操作时间： | 10ms |
| 释放时间： | 10ms |
| 线圈功率： | 360 mW |
| 线圈电阻： | 400 欧姆 |
| 工作温度： | -40°C ~ 70°C |
| 其它名称： | G6W 1045H G6WK-1PDC12 G6WK1P12DC G6WK1PDC12 |
DISCONTINUED
Recommended Soldering Method
■ Temperature Profile According to IRS Method
When performing reflow-soldering, check the profile on an actual device
after setting the temperature condition so that the temperatures at the
relay terminals and the upper surface of the case do not exceed the
limits specified in the following table.
The thickness of cream solder to be applied should be within a range
between 150 and 200 μ m on OMRON's recommended PCB pattern.
Correct Soldering
Incorrect Soldering
T4
T3
PCB
Relay
Terminal
Solder
Land
Insufficient
amount of
solder
Excessive
amount of
solder
T2
Visually check that the Relay is properly soldered.
T1
Bottom Ground Soldering Conditions
To solder the bottom ground, manually solder separately from the
terminals according to the following conditions.
? Soldering iron: 50 W
? Iron temperature: 380 ° C to 400 ° C
? Soldering time: 10 s max.
Item
t 1
Preheating
t 2
Soldering
Time (s)
Note: The above conditions are for a PCB with OMRON’s recommended
patterns and hole perforations. The conditions will depend on the
PCB being used. Therefore, it is recommended to double-check
the suitability under actual PCB conditions.
Measuring
position
Terminal
Preheating Soldering
(T1 to T2, t 1 ) (T3, t 2 )
150 ° C to 180 ° C, 230 ° C min.,
Peak value
(T4)
250 ° C max.
Soldering
Soldering temperature: Approx. 250 ° C (At 260 ° C if the DWS method is
used.)
120 s max.
Upper surface ---
of case
30 s max.
---
255 ° C max.
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and
approx. 3 s for the second time if the DWS method is used.)
Be sure to adjust the level of the molten solder so that the solder will not
overflow onto the PCB.
Precautions
A
■ Correct Use
Handling
Use the Relay as soon as possible after opening the moisture-proof
package. If the Relay is left for a long time after opening the moisture-
proof package, the appearance may suffer and seal failure may occur
after the solder mounting process. To store the Relay after opening the
moisture-proof package, place it into the original package and sealed the
package with adhesive tape.
When washing the product after soldering the Relay to a PCB, use a
water-based solvent or alcohol-based solvent, and keep the solvent tem-
perature to less than 40 ° C. Do not put the Relay in a cold cleaning bath
immediately after soldering.
Dropping the Relay may cause damage to its functional capability.
Never use the Relay if it is dropped.
Protect the Relays from direct sunlight during operation, storage, and
transportation and keep the relays under normal temperature, humidity,
and pressure.
Coating
Do not use silicone coating to coat the Relay when it is mounted to
the PCB. Do not wash the PCB after the Relay is mounted using
detergent containing silicone. Otherwise, the detergent may remain
on the surface of the Relay.
Claw Securing Force During Automatic Insertion
During automatic insertion of Relays, make sure to set the securing force
of the claws to the following values so that the Relay characteristics will
be maintained.
C
B
Direction A: 4.90 N max.
Direction B: 9.80 N max.
Direction C: 9.80 N max.
Secure the claws to the area indicated by shading.
Do not attach them to the center area or to only part of the
Relay.
Latching Relay Mounting
Make sure that the vibration or shock that is generated from other
devices, such as relays in operation, on the same panel and imposed on
the Latching Relay does not exceed the rated value, otherwise the Latch-
ing Relay that has been set may be reset or vice versa. The Latching
Relay is reset before shipping. If excessive vibration or shock is imposed,
however, the Latching Relay may be set accidentally. Be sure to apply a
reset signal before use.
High-frequency Relay
G6W
333
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相关代理商/技术参数 |
参数描述 |
|---|---|
| G6WK1PDC24 | 制造商:Omron Electronic Components LLC 功能描述:RELAY RF SPDT 10MA 24V |
| G6WK1PDC3 | 制造商:Omron Electronic Components LLC 功能描述:RELAY RF SPDT 10MA 3V |
| G6WK-1P-DC4.5 | 功能描述:高频/射频继电器 5 GHZ SPDT 4.5VDC FREQ RoHS:否 制造商:Omron Electronics 触点形式:2 Form C (DPDT-BM) 触点电流额定值: 线圈电压:5 VDC 线圈类型:Non-Latching 频率: 功耗:100 mW 端接类型:Solder Terminal 绝缘:20 dB to 30 dB at 1 GHz 介入损耗:0.2 dB at 1 GHz |
| G6WK1PDC45 | 制造商:Omron Electronic Components LLC 功能描述:RELAY RF SPDT 10MA 4.5V |
| G6WK1PDC6 | 制造商:Omron Electronic Components LLC 功能描述:RELAY RF SPDT 10MA 6V |
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